This Week in the Chain — Jul 31, 2026

Top gainers

332 companies moved 1% or more since Jul 27, 2026. Figures are live market caps; moves reflect price action plus any share-count updates.

1. 1Lingsen Precision$30M → $40M+33.3%
2. 2Celestica$34.1B → $40.5B+18.9%
3. 3Advantest$125.5B → $146.7B+16.9%
4. 4Avantor$8.1B → $9.4B+16.1%
5. 5Microsoft$2.89T → $3.35T+15.7%
6. 6Ambarella$2.8B → $3.3B+14.8%
7. 7Littelfuse$9.9B → $11.2B+12.9%
8. 8Fuji Electric$11.6B → $13.0B+12.3%

Source: wafergraph live market caps (Yahoo Finance × SEC shares). As of 2026-07-31.

Top decliners

1. 1Tongfu Microelectronics$17.2B → $12.8B-25.9%
2. 2Faraday Technology$1.6B → $1.2B-25.3%
3. 3Wafer Works$2.1B → $1.6B-23.0%
4. 4JCET Group$21.8B → $17.4B-20.1%
5. 5Walsin Technology$4.1B → $3.3B-19.9%
6. 6GlobalWafers$15.8B → $12.7B-19.7%
7. 7Yageo$39.8B → $32.0B-19.6%
8. 8Amkor Technology$14.9B → $12.0B-19.6%

Source: wafergraph live market caps. As of 2026-07-31.

Coverage changes

Dataset coverage versus Jul 27, 2026.

Source: wafergraph dataset. As of 2026-07-31.

Why it matters

Lingsen Precision sits in OSAT — Outsourced semiconductor assembly and test (OSAT) companies package finished dies into the chips and modules that go into end products. As advanced packaging — chiplets, CoWoS, HBM stacking, and fan-out technologies — moves from niche to mainstream, OSATs have become strategic partners rather than commodity handlers. ASE Technology (which includes SPIL) is the world's largest OSAT; Amkor is a major player in advanced packaging in the Americas and Korea. TSMC and Samsung also offer advanced packaging in-house, competing directly with OSATs at the leading edge. 22 companies in the wafergraph dataset sit in OSAT.

Segment context from the wafergraph taxonomy.