wafergraph — the semiconductor & AI supply-chain graph

A free, current, neutral map of the semiconductor & AI supply chain: 456+ companies across the full value chain (materials → equipment → EDA/IP → chip design → foundry → memory → packaging → distribution → AI & data center), with financials, supply-chain dependencies, market share, and chokepoint exposure.

Value-chain segments

  • Materials
  • Equipment (Front End)
  • Equipment (Back End)
  • EDA & IP
  • Design (Fabless)
  • IDM
  • Foundry
  • Memory
  • Analog, Power, RF
  • OSAT
  • Distribution & Misc
  • AI & Data Center

Major companies

  • Amazon (Annapurna Labs) — Designs Graviton CPUs and Trainium AI chips for AWS via Annapurna Labs.
  • Apple — Designs A/M-series SoCs and modems for its own devices; TSMC's largest customer.
  • Alphabet (Google) — Designs TPU AI accelerators and Tensor phone SoCs for internal use.
  • Microsoft — Designs Maia AI accelerators and Cobalt server CPUs for Azure.
  • NVIDIA — Dominant AI accelerator and GPU designer; also networking via Mellanox line.
  • Meta Platforms — Designs MTIA inference accelerators for its own data centers.
  • Alibaba Group — Chinese cloud leader; T-Head designs Yitian CPUs and Hanguang AI chips.
  • Dell Technologies — Top AI server and infrastructure systems integrator.
  • Robert Bosch — Top automotive MEMS sensor maker with growing SiC fab capacity.
  • Tesla — Designs FSD and AI training chips for its vehicles and data centers.
  • TSMC — World's dominant foundry, manufacturing nearly all leading-edge chips.
  • Sony Semiconductor Solutions — Dominant CMOS image sensor maker for smartphones and cameras.
  • IBM — Enterprise computing and cloud; designs its own Power and Telum chips.
  • Merck KGaA (EMD Electronics) — Supplies deposition materials, spin-on dielectrics and specialty gases.
  • Broadcom — Networking silicon leader and main designer of hyperscaler custom AI chips.
  • Delta Electronics — Power supplies, cooling, and power management for data centers and EVs.
  • Hitachi High-Tech — Hitachi subsidiary strong in conductor etch and CD-SEM metrology.
  • Oracle — Enterprise software giant; OCI is a fast-growing AI cloud renting GPUs.
  • Cisco Systems — Networking giant supplying AI data-center switching and silicon.
  • Intel — x86 CPU IDM building an external foundry business on 18A and beyond.
  • Qualcomm — Leading smartphone SoC and modem designer, expanding into PC and auto.
  • Schneider Electric — Energy management and data-center power/cooling infrastructure.
  • Micron Technology — Only US-based DRAM/NAND maker; ramping HBM for AI accelerators.
  • Hana Micron — Korean OSAT serving Samsung and SK hynix memory packaging.
  • ASML — Sole supplier of EUV lithography machines required for all leading-edge chips.
  • AMD — x86 CPU and Instinct GPU designer; owns Xilinx FPGA franchise.
  • Hewlett Packard Enterprise — Enterprise servers, HPC, and AI systems (incl. Cray).
  • Linde — World's largest industrial gas company; major electronics gas business.
  • Arrow Electronics — Global electronic component distributor and supply chain services.
  • Jabil — Global EMS manufacturer building electronics and data-center hardware.
  • Applied Materials — Broadest wafer fab equipment maker, leading in deposition and implant.
  • Flex Logix — Embedded-FPGA IP and AI inference acceleration technology.
  • Eaton — Electrical power management and data-center power infrastructure.
  • Canon — Supplies KrF/i-line lithography and is commercializing nanoimprint litho.
  • Avnet — Global distributor with strong design-chain services.
  • Super Micro Computer — AI server and liquid-cooled rack systems builder.
  • ASE Technology — World's largest OSAT, includes SPIL; key advanced packaging partner.
  • Lam Research — Etch leader, critical to 3D NAND and advanced logic patterning.
  • Baidu — Chinese AI and cloud leader; designs Kunlun AI accelerators.
  • Texas Instruments — Largest analog chipmaker, manufacturing on its own 300mm fabs.