Rapidus–IBM 2nm partnership
Rapidus–IBM 2nm partnership is a foundry_deal announced 2022-12-13, currently under_construction. Japan-backed Rapidus licensed IBM 2nm nanosheet tech for its Hokkaido fab, targeting ~2027.
Deal record from the wafergraph deals corpus · every field traces to the sources listed below · page data as of 2026-09-05
- Type
- foundry_deal
- Announced
- 2022-12-13
- Status
- under_construction
- Parties
- Rapidus (builder), IBM (partner)
- Source confidence
- high
The companies involved
Rapidus
Government-backed Japanese foundry targeting 2nm production in 2027. challenger in Pure-Play Foundry, headquartered in Japan. 2 tracked suppliers, 6 tracked customers
IBM
Enterprise computing and cloud; designs its own Power and Telum chips. major in Hyperscalers, headquartered in United States, market cap $221.3B. 6 tracked suppliers, 1 tracked customers · supply-chain risk
Sources
Cite as: wafergraph, “Rapidus–IBM 2nm partnership”, https://wafergraph.com/deal/rapidus_ibm/ (data as of 2026-09-05).
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