Diligence packs

Materials

• Absolics Inc. — SKC subsidiary building a first-of-its-kind glass core substrate mass-production fab in Covington, Georgia.
• Adeka — Chemicals maker supplying high-k/ALD precursors and additives.
• AGC Inc. — Glass and chemicals maker; leading EUV photomask blanks and fluorinated gases.
• Air Liquide — Top industrial and electronic specialty gas supplier to fabs worldwide.
• Air Products — Major supplier of bulk and specialty gases to semiconductor fabs.
• Ajinomoto — Supplies effectively all ABF build-up film, the insulator in advanced CPU/GPU substrates.
• Albemarle Corporation — Lithium and specialty chemicals producer; supplies anhydrous hydrogen bromide for semiconductor plasma etching and butyllithium as an electronic-grade intermediate.
• Arkema — French specialty chemicals group supplying plasma-etch gases (Foranext), ALD/CVD alkylamines, and polyimides for semiconductor and flexible-circuit manufacturing.
• AT&S — Austrian high-end IC substrate and PCB maker expanding advanced packaging.
• Avantor — Materials and services supplier of ultrapure process chemicals to fabs.
• BASF SE — German chemicals major; supplies CMP slurries (PLANAPUR), post-CMP cleaning chemistries, and electronic-grade wet chemicals for wafer fabrication.
• Brewer Science — Specialty spin-on and temporary-bonding materials for advanced packaging.
• Chang Wah Technology — Leadframe and semiconductor packaging materials maker.
• Daeduck Electronics — Korean PCB and IC-substrate manufacturer.
• Dai Nippon Printing — Top-tier photomask producer alongside its printing businesses.
• Daikin Industries — Fluorochemicals maker supplying etch gases and coatings alongside HVAC.
• DNF — Korean maker of CVD/ALD precursors and thin-film materials.
• Dongjin Semichem — Korean photoresist and process-chemical maker supplying Samsung and SK hynix.
• Doosan Electro-Materials — Korean copper-clad laminate and IC-substrate materials maker.
• DuPont — Broad electronic materials supplier; electronics unit being spun off as Qnity.
• Element Solutions — Specialty chemicals for electronics assembly and advanced packaging.
• Entegris — Leader in contamination control, materials handling and CMP consumables.
• Ferrotec — Supplies vacuum feedthroughs, ceramics and materials to equipment makers.
• Foosung — Korean fluorine chemicals and specialty-gas maker.
• FUJIFILM — Electronic materials arm supplies resists, CMP slurries and chemicals.
• Fujimi Incorporated — Specialist leader in CMP slurries and polishing materials.
• GlobalWafers — Third-largest silicon wafer maker; expanding US capacity in Texas.
• Haesung DS — Korean leadframe and package-substrate maker.
• Hansol Chemical — Korean precursor and process-chemical supplier to memory and logic fabs.
• Heraeus — Family-owned precious metals group supplying targets and bonding wire.
• HOYA — Dominant maker of EUV photomask blanks and substrates.
• Ibiden — Leading IC package substrate maker; key supplier for Intel and AI packages.
• IQE — Leading epitaxial compound-semiconductor wafer maker (GaAs, GaN, InP).
• ITEQ — Copper-clad laminate and prepreg maker for high-speed PCBs.
• Iwatani — Industrial and electronic specialty-gas supplier.
• Jiangsu Nata Opto-electronic Material (Nanda Optoelectronics) — Suzhou maker of MO sources, ALD/CVD precursors, electronic specialty gases and ArF photoresist materials.
• JSR — Top photoresist maker incl. EUV resists; taken private by JIC in 2024.
• JX Advanced Metals — World leader in sputtering targets for chip metallization; listed in 2025.
• Kanto Denka Kogyo — Specialty fluorine gas and etchant chemical maker.
• Kingboard Holdings — Major maker of copper-clad laminates and PCB materials.
• Kinsus Interconnect — Pegatron-affiliated IC substrate manufacturer.
• Kyocera — Ceramic packages, substrates, and electronic components.
• LG Innotek — LG affiliate making IC substrates, camera modules, and components.
• Linde — World's largest industrial gas company; major electronics gas business.
• Materion — Advanced materials maker supplying targets and precious-metal products.
• Merck KGaA (EMD Electronics) — Supplies deposition materials, spin-on dielectrics and specialty gases.
• Mitsubishi Chemical Group — Diversified chemicals; electronic materials, polishing slurries, and films.
• Mitsubishi Gas Chemical — Cleaning chemicals and BT substrate resin maker.
• Mitsubishi Materials — Advanced materials; bonding wire, cemented carbide, and low-alpha solder/plating chemicals (exited sputtering targets, complete March 2024).
• Mitsui Chemicals, Inc. — First commercial EUV pellicle manufacturer (ASML license); developing CNT pellicles for High-NA EUV.
• Mitsui High-tec — Leading leadframe maker and precision stamping specialist.
• MK Electron — Korean bonding-wire and solder-materials maker.
• Nagase & Co. — Chemicals trading house and electronic-materials maker.
• Nan Ya PCB — Formosa-group package substrate and PCB maker.
• National Silicon Industry Group — China's largest 300mm silicon wafer maker (Zing Semiconductor).
• Ningbo Jiangfeng Electronic Material (Konfoong) — China's leading maker of ultra-high-purity sputtering targets (Al, Ti, Ta) for semiconductor metallization.
• Nippon Electric Glass — Japanese glass maker; supplies through-glass-via (TGV) glass core substrates for advanced chip packaging and image sensor cover glass.
• Nippon Sanso Holdings — Japanese industrial gas group with strong electronics gas share in Asia.
• Nissan Chemical — Specialty chemicals maker; anti-reflective and spin-on materials for fabs.
• Nitto Denko Corporation — Japanese materials group; supplies semiconductor wafer dicing tape and back-grinding tape.
• Ohara Inc. — Japanese optical and electronic glass maker; supplies low-expansion glass-ceramics and quartz glass for semiconductor exposure equipment and photomask substrates.
• Photronics — Largest merchant photomask manufacturer.
• Resonac — Formed from Showa Denko and Hitachi Chemical; broad back-end materials line.
• Samsung Electro-Mechanics — Samsung affiliate making IC substrates, MLCCs, and camera modules.
• SCHOTT AG — German specialty glass maker owned by the Carl Zeiss Foundation; supplies fused quartz for etch/epitaxy/diffusion equipment, photomask blank glass, and photostructurable FOTURAN glass wafers.
• Shengyi Technology — Copper-clad laminates and substrate materials for PCBs.
• Shennan Circuits — Chinese PCB and IC substrate maker.
• Shin-Etsu Chemical — World's largest silicon wafer maker and a major photoresist supplier.
• Shinko Electric Industries — Package substrate and leadframe maker; taken private by JIC and delisted from TSE in June 2025.
• Siltronic — Top-four silicon wafer producer headquartered in Munich.
• Simmtech — Korean maker of semiconductor substrates and memory-module PCBs.
• SK Enpulse — SK affiliate; divested CMP pads to Hahn & Co. and blank photomasks to Fusion New Material in 2025; absorbed into parent SKC via merger effective 2025-12-23, ceasing as an operating company.
• SK Siltron — SK Group's wafer arm; key 300mm supplier to Korean memory fabs.
• SK Specialty — Korean specialty-gas maker and a top global NF3 supplier.
• Soitec — Dominant supplier of engineered SOI substrates for RF and FD-SOI chips.
• Solar Applied Materials — Taiwanese sputtering target and precious-metal recycling specialist.
• Solvay — Specialty chemicals group supplying high-purity electronic materials.
• Soulbrain — Korea's leading process-chemical and etchant maker, including high-purity HF.
• Stella Chemifa — World's leading maker of high-purity hydrofluoric acid for semiconductors.
• SUMCO — Second-largest silicon wafer producer, supplying all leading fabs.
• Sumitomo Bakelite — Semiconductor encapsulation resins and packaging materials.
• Sumitomo Chemical — Diversified chemicals group with significant photoresist business.
• Sumitomo Metal Mining — Materials maker supplying bonding wire, plating, and target metals.
• Suzhou Crystal Clear Chemical (Jingrui) — Suzhou maker of ultra-high-purity wet chemicals/reagents and photoresist for IC and display manufacturing.
• Taiwan Mask Corporation — Taiwanese merchant photomask maker.
• Tanaka Precious Metals — Precious-metals group supplying bonding wire, plating, and targets.
• TanKeBlue Semiconductor — Beijing pioneer of China's SiC substrate industry; a leading SiC monocrystalline substrate supplier.
• Tokuyama — Japanese chemical maker; semiconductor-grade polysilicon and fumed silica.
• Tokyo Ohka Kogyo — Photoresist specialist with leading EUV resist share.
• TOPPAN Holdings — Major merchant photomask maker within diversified printing group.
• Toray Industries — Japanese materials group; supplies PHOTONEECE photosensitive polyimide used for passivation and dielectric layers in semiconductor packaging.
• Tosoh — Supplies sputtering targets and quartzware for fabs.
• TTM Technologies — North America's largest PCB maker; RF and substrate components.
• Umicore — Belgian materials group supplying sputtering targets, evaporation materials, and copper electroplating chemistries for advanced packaging and semiconductor front-end processes.
• Unimicron — Largest Taiwanese ABF substrate maker serving major fabless customers.
• UP Chemical — Korean maker of CVD/ALD precursors for chip fabrication.
• Wacker Chemie — Major polysilicon and silicone maker supplying semiconductor-grade silicon.
• Wafer Works — Taiwanese silicon wafer maker focused on prime and reclaim wafers.
• Wonik Materials — Korean specialty-gas and precursor supplier for chip fabs.
• Zhen Ding Technology — World's largest PCB maker; flexible and IC substrate supplier to Apple.

Equipment (Front End)

• ACM Research — Cleaning equipment challenger with most revenue from China fabs.
• Advanced Energy — Precision power conversion for plasma processes in fab tools.
• AIXTRON — Leading MOCVD equipment maker for SiC, GaN and LED production.
• AMEC (Advanced Micro-Fabrication) — Chinese plasma etch maker qualified at advanced foundries.
• Applied Materials — Broadest wafer fab equipment maker, leading in deposition and implant.
• ASM International — Leader in atomic layer deposition (ALD) and epitaxy tools.
• ASML — Sole supplier of EUV lithography machines required for all leading-edge chips.
• Atlas Copco — Industrial group; Edwards vacuum pumps and abatement for fabs.
• Axcelis Technologies — Ion implantation pure-play, strong in power semiconductor fabs.
• Brooks Automation — Vacuum robotics and automation for wafer handling.
• Bruker — Scientific instruments maker; metrology and analysis tools for semis.
• Camtek — Inspection and metrology for advanced packaging and HBM.
• Canon — Supplies KrF/i-line lithography and is commercializing nanoimprint litho.
• Carl Zeiss SMT — Sole maker of the precision optics inside every ASML lithography system.
• ClassOne Technology — Wet-processing and electroplating tools for 200mm and specialty fabs.
• Comet Group — RF power delivery and X-ray systems for semiconductor manufacturing.
• Daifuku — Dominant supplier of automated material handling (OHT) inside fabs.
• Ebara — CMP systems maker and leading dry vacuum pump supplier.
• Eugene Technology — Korean LPCVD and ALD deposition equipment specialist.
• Evatec — Swiss thin-film deposition (PVD) systems for packaging and photonics.
• Hana Materials Inc. — South Korean maker of silicon and SiC electrodes/rings consumed in semiconductor dry-etch equipment.
• Hitachi High-Tech — Hitachi subsidiary strong in conductor etch and CD-SEM metrology.
• Horiba — Mass-flow controllers and analytical instruments for fabs.
• HPSP — Near-monopoly maker of high-pressure hydrogen annealing equipment.
• Hwatsing Technology — China's leading domestic CMP (planarization) equipment maker.
• Ichor Holdings — Fluid delivery subsystems for etch and deposition tools.
• INFICON — Vacuum instrumentation and process-control sensors for fabs.
• JEOL — Electron-beam lithography and e-beam metrology instruments.
• Jusung Engineering — Korean ALD, CVD, and epitaxy equipment maker.
• KCTECH — Korean cleaning and CMP equipment maker.
• Kingsemi — Chinese coater/developer and single-wafer cleaning equipment maker.
• KLA — Dominant in process control: wafer inspection and metrology.
• Kokusai Electric — Specialist in batch thermal deposition furnaces for memory and logic.
• Lam Research — Etch leader, critical to 3D NAND and advanced logic patterning.
• Lasertec — Only supplier of actinic EUV photomask inspection systems.
• MKS Instruments — Key subsystem supplier: RF power, vacuum gauges, lasers and optics.
• NAURA Technology — China's largest domestic fab equipment maker across etch and deposition.
• Nikon — DUV lithography maker; distant second to ASML in scanners.
• Nova — Dimensional and materials metrology specialist for process control.
• Onto Innovation — Metrology and inspection for advanced nodes and packaging.
• Oxford Instruments — Plasma etch and deposition tools for compound semis and research.
• Park Systems — Leading atomic-force-microscopy (AFM) metrology maker.
• Pfeiffer Vacuum — Vacuum-pump maker for semiconductor and analytical applications.
• Piotech — Chinese thin-film deposition (PECVD and ALD) equipment maker.
• Plasma-Therm — Plasma etch and deposition systems for specialty and compound-semi devices.
• PSK Inc — Korean dry-strip and etch equipment maker.
• SCREEN Holdings — Leader in wafer cleaning equipment and coater/developer systems.
• SEMES — Samsung's in-house equipment arm; etch, cleaning, and packaging tools.
• Semilab — Hungarian semiconductor metrology and materials characterization tools.
• Shanghai Micro Electronics (SMEE) — China's domestic lithography scanner developer.
• SiCarrier — Chinese semiconductor-equipment maker spanning process and inspection tools.
• Sumitomo Heavy Industries — Industrial group making ion implanters and precision equipment.
• Tokyo Electron — Japan's biggest fab equipment maker; near-monopoly in coater/developers.
• TRUMPF — Sole supplier of the CO2 drive lasers powering EUV light sources.
• Ultra Clean Holdings — Outsourced gas delivery modules and subsystems for equipment OEMs.
• ULVAC — Vacuum equipment maker; sputtering and deposition systems for semis.
• Ushio — Industrial light source maker for lithography and inspection.
• VAT Group — Dominant maker of vacuum valves for semiconductor process tools.
• Veeco Instruments — Deposition specialist: laser annealing, MBE, ion beam and MOCVD.
• Wonik IPS — Korean deposition and thermal-process equipment maker for memory fabs.
• Wonik QnC — Korean quartzware and ceramic components maker for fab tools.
• Zhongke Feice Technology — Chinese metrology and inspection equipment maker.

Equipment (Back End)

• Advantest — Test leader; its testers qualify nearly every AI accelerator and HBM stack.
• Aehr Test Systems — Wafer-level burn-in test systems, used heavily for SiC devices.
• ASMPT — Largest back-end assembly and packaging equipment maker; TCB leader.
• BE Semiconductor Industries — Assembly equipment leader and front-runner in hybrid bonding.
• Beijing Huafeng Test & Control (AccoTest) — Beijing maker of automated test equipment (ATE) for analog, mixed-signal and power ICs.
• Chroma ATE — Taiwanese test and measurement instrument maker for semis and batteries.
• Cohu — Test handlers, contactors and inspection for back-end test cells.
• DISCO — Controls most of the market for wafer dicing and grinding equipment.
• EV Group — Private Austrian leader in wafer bonding and litho for packaging.
• FormFactor — World's largest probe card maker for wafer test.
• Hangzhou Changchuan Technology — Chinese test handler and tester maker.
• Hanmi Semiconductor — Korean leader in TC bonders used to stack HBM memory.
• inTEST — Thermal and test-handling solutions for semiconductor test.
• ISC — Korean burn-in and test socket maker.
• Kulicke & Soffa — Dominant in wire bonders; expanding into advanced packaging.
• Leeno Industrial — Korean probe pin and test socket maker.
• MPI Corporation — Probe cards and test and measurement systems maker.
• Nordson — Dispensing, bonding inspection, and test systems for electronics and semis.
• SUSS MicroTec — Packaging lithography, coaters and bonders for advanced packaging.
• Technoprobe — Leading probe card maker for advanced logic and memory test.
• Teradyne — One half of the ATE duopoly with Advantest; strong in SoC and analog test.
• Tokyo Seimitsu (Accretech) — Wafer dicing, grinding, and metrology equipment maker.
• TOWA — Leader in semiconductor molding/encapsulation equipment.

EDA & IP

• Adeia Inc. — Pure-play IP licensor holding foundational DBI hybrid-bonding patents key to HBM stacking and 3D chiplets.
• Agile Analog — Configurable analog IP for system-on-chips.
• Aldec, Inc. — US EDA company providing FPGA/ASIC simulation and functional verification for safety-critical designs.
• Alphawave Semi — High-speed connectivity SerDes IP; acquired by Qualcomm and delisted from LSE in December 2025, now a Qualcomm subsidiary.
• AnaGlobe Technology, Inc. — Taiwanese EDA firm specializing in IC physical-layout integration and custom layout automation.
• Andes Technology — Taiwanese RISC-V CPU IP vendor.
• Arm Holdings — CPU architecture licensed in virtually every smartphone and most edge devices.
• Arteris — Network-on-chip (NoC) interconnect IP for SoC designs.
• Atomera — Materials-engineering technology (MST) licensed to chipmakers.
• Cadence Design Systems — EDA duopolist with Synopsys; strong in analog, PCB and verification.
• Ceva — Licenses DSP, wireless connectivity and edge AI IP cores.
• Codasip — European RISC-V processor IP company.
• eMemory Technology — Leading embedded non-volatile memory IP licensor.
• Empyrean Technology — China's leading domestic EDA software company.
• Faraday Technology — Taiwanese ASIC design-service and silicon IP provider.
• Flex Logix — Embedded-FPGA IP and AI inference acceleration technology.
• Imagination Technologies — GPU and AI IP licensor, owned by Canyon Bridge.
• Keysight Technologies — Test and measurement leader; RF, photonic, and high-speed EDA tools.
• M31 Technology — Taiwanese silicon IP licensor of foundation and interface IP.
• Primarius Technologies — Chinese EDA maker focused on circuit simulation and device modeling.
• Rambus — Memory interface chips and high-speed interface IP.
• Semidynamics — Customizable RISC-V cores with vector and AI extensions.
• Siemens EDA — Third major EDA vendor (ex-Mentor Graphics), a division of Siemens AG.
• SiFive — Leading commercial RISC-V CPU IP company.
• Silvaco Group, Inc. — EDA software (TCAD, SPICE, extraction) and semiconductor IP for power, display, memory and automotive.
• StarFive — Chinese RISC-V CPU IP and SoC company.
• Synopsys — Largest EDA vendor and major interface IP supplier; acquired Ansys in 2025.
• VeriSilicon — Chinese IP licensing and turnkey chip design services company.

Design (Fabless)

• Achronix — Fabless FPGA and embedded-FPGA (eFPGA) IP supplier.
• Actions Technology — Audio and IoT SoC designer.
• Airoha Technology — Wireless connectivity and audio SoC designer in the MediaTek group.
• Alchip Technologies — ASIC design services leader for AI and HPC chips on TSMC processes.
• Allwinner Technology — Chinese application processor designer for tablets, IoT, and auto.
• Alphabet (Google) — Designs TPU AI accelerators and Tensor phone SoCs for internal use.
• Altera — FPGA maker; former Intel PSG, now majority-owned by Silver Lake.
• Amazon (Annapurna Labs) — Designs Graviton CPUs and Trainium AI chips for AWS via Annapurna Labs.
• Ambarella — Low-power computer vision SoCs for cameras and automotive.
• AMD — x86 CPU and Instinct GPU designer; owns Xilinx FPGA franchise.
• Amlogic — Set-top box, TV and smart home SoC designer.
• Ampere Computing — Arm-based server CPU designer for cloud and hyperscale.
• Apple — Designs A/M-series SoCs and modems for its own devices; TSMC's largest customer.
• ASMedia Technology — High-speed I/O controller designer (USB, PCIe, SATA).
• ASPEED Technology — Dominant supplier of BMC server management chips.
• Astera Labs — Connectivity chips (retimers, CXL, PCIe switches) for AI servers.
• Axelera AI — European edge AI accelerator startup.
• Biren Technology — Chinese GPGPU startup for AI training.
• Blaize — Edge AI inference processors and a software platform.
• Broadcom — Networking silicon leader and main designer of hyperscaler custom AI chips.
• Cambricon Technologies — China's flagship listed AI accelerator designer.
• Cerebras Systems — Wafer-scale AI processor maker; IPO process underway.
• Cornelis Networks, Inc. — US startup building Omni-Path high-performance interconnect fabrics for AI and HPC clusters.
• Credo Technology — Active electrical cables and SerDes connectivity for data centers.
• d-Matrix — In-memory-compute AI inference chip startup.
• Efinix — FPGA startup with a quantum-fabric architecture for edge applications.
• Elan Microelectronics — Touchpad, touchscreen, and microcontroller designer.
• Enfabrica Corporation — US fabless startup making the ACF SuperNIC, a 3.2 Tbps GPU networking chip for AI infrastructure.
• Enflame Technology — Chinese AI training and inference chip designer backed by Tencent.
• Esperanto Technologies — RISC-V based AI inference accelerator designer; ceased operations July 2025, IP acquired by Ainekko/Nekko.ai.
• Espressif Systems — Maker of the ubiquitous ESP32 WiFi/Bluetooth microcontrollers.
• Etched — Startup building transformer-specialized inference ASICs (Sohu).
• Fitipower — Display driver and power management IC designer.
• FuriosaAI — Korean AI inference chip startup.
• Global Unichip (GUC) — TSMC-affiliated ASIC design services company for advanced nodes.
• Gowin Semiconductor — Chinese FPGA maker.
• Graphcore — AI accelerator (IPU) maker; wholly-owned SoftBank subsidiary since July 2024.
• Groq — AI inference chip and cloud provider built on its LPU architecture.
• Hailo — Israeli edge AI accelerator startup.
• Himax Technologies — Display drivers plus ultralow-power AI vision sensors.
• HiSilicon — Huawei's chip design arm: Kirin SoCs and Ascend AI accelerators.
• Holtek Semiconductor — Taiwanese microcontroller and analog IC maker.
• Hygon Information Technology — Chinese x86 CPU and DCU accelerator designer (AMD-licensed lineage).
• Ilitek — Touch and display driver IC designer.
• indie Semiconductor — Automotive-focused fabless designer for ADAS and user experience chips.
• Ingenic Semiconductor — Chinese MCU, edge SoC, and automotive memory designer.
• Kneron — Edge AI neural-processing chips and software.
• Lattice Semiconductor — Leader in small, low-power FPGAs.
• Loongson Technology — Chinese CPU designer with its own LoongArch instruction set.
• LX Semicon — Korea's largest fabless display driver IC designer, an LG affiliate.
• Marvell Technology — Data infrastructure silicon: custom AI compute, optical DSPs, storage.
• MaxLinear — Broadband, connectivity, and infrastructure mixed-signal chip designer.
• MediaTek — Highest-volume smartphone SoC vendor; strong in TV and connectivity chips.
• MegaChips — Japanese ASIC and system-LSI designer.
• Meta Platforms — Designs MTIA inference accelerators for its own data centers.
• MetaX Integrated Circuits (Muxi) — Shanghai GPU startup founded by ex-AMD veterans; STAR-listed maker of training and inference GPUs.
• Microsoft — Designs Maia AI accelerators and Cobalt server CPUs for Azure.
• Montage Technology — Memory interface buffer chips for server DIMMs.
• Moore Threads — Chinese GPU startup targeting graphics and AI compute.
• Mythic — Analog in-memory-compute AI inference chip startup.
• Nordic Semiconductor — Leader in Bluetooth Low Energy wireless SoCs.
• Novatek Microelectronics — Top display driver IC and timing controller designer.
• Nuvoton Technology — Microcontroller and analog maker; owns Panasonic's former semi business.
• NVIDIA — Dominant AI accelerator and GPU designer; also networking via Mellanox line.
• Panmnesia — South Korean fabless startup shipping CXL 3.2 fabric switch silicon for composable AI memory disaggregation.
• Parade Technologies — High-speed interface and display timing controller designer.
• Phytium — Chinese Arm-based server and desktop CPU designer.
• Qualcomm — Leading smartphone SoC and modem designer, expanding into PC and auto.
• QuickLogic — Low-power FPGA and embedded-FPGA IP company.
• Raydium Semiconductor — Display driver IC maker for panels and touch.
• Realtek Semiconductor — High-volume connectivity, audio codec and Ethernet chip designer.
• Rebellions — Korean AI accelerator startup formed by merger with Sapeon.
• Rockchip — Chinese application processor designer for tablets, IoT and edge AI.
• SambaNova Systems — AI chip and systems startup building reconfigurable dataflow accelerators.
• Semtech — LoRa wireless franchise plus optical data center connectivity chips.
• Sequans Communications — Cellular IoT (5G/4G) chipmaker.
• Silicon Labs — Wireless MCUs for IoT: Zigbee, Thread, Matter and BLE.
• SiMa.ai — Edge AI MLSoC for embedded, robotics, and automotive inference.
• SiPearl — European HPC processor designer (Rhea) for exascale computing.
• Sitronix Technology — Taiwanese display driver IC designer.
• Socionext — Japanese custom SoC design house for auto and data center customers.
• Synaptics — Human interface and IoT connectivity chip designer.
• Telechips — Korean automotive infotainment and display SoC designer.
• Telink Semiconductor — Low-power wireless IoT SoC designer.
• Tenstorrent — AI accelerator and RISC-V IP company led by Jim Keller.
• Tesla — Designs FSD and AI training chips for its vehicles and data centers.
• u-blox — Positioning (GNSS) and wireless communication chips and modules.
• UNISOC — China's largest independent mobile SoC designer after HiSilicon.
• Valens Semiconductor — Connectivity chip maker (MIPI A-PHY, HDBaseT).
• Vastai Technologies — Shanghai fabless designer of 7nm general-purpose acceleration chips for AI, video and cloud workloads.
• Ventana Micro Systems — RISC-V data-center CPU chiplet designer.
• Xsight Labs Ltd. — Israeli fabless startup making the E1 800G DPU and X-series Ultra Ethernet switch silicon for AI data centers.
• Zhaoxin — Chinese x86 CPU joint venture between VIA and the Shanghai government.

Analog, Power, RF

• 3Peak — Chinese high-performance analog IC designer.
• Allegro MicroSystems — Magnetic sensor and power IC leader for automotive.
• Alpha and Omega Semiconductor — Power MOSFET and power IC designer.
• Amphenol — Diversified maker of electrical, electronic and fiber-optic connectors, interconnect systems, antennas and sensors; expanding fast in AI data-center interconnect.
• ams OSRAM — Optical sensor and LED maker for consumer and automotive.
• Asahi Kasei Microdevices (AKM) — Audio codec, converter, and magnetic sensor IC maker (AKM).
• Awinic Technology — Chinese analog and mixed-signal designer of audio amps and haptics.
• BizLink Holding — Cable-assembly and connector maker serving AI data-center, automotive/EV and industrial customers.
• Bourns — Circuit protection, passives, and power components.
• Cambridge GaN Devices (CGD) — UK fabless GaN power company spun out of Cambridge University; enhancement-mode ICeGaN transistors.
• Chilisin Electronics — Inductor and magnetic-component maker; Yageo-owned since 2022, brand folded into Pulse Electronics (still trades as TWSE: 2425).
• Chipsea Technologies — Chinese mixed-signal and MCU chipmaker.
• Cirrus Logic — Audio and mixed-signal chips; heavily concentrated in Apple devices.
• Diodes Incorporated — High-volume discrete and analog supplier for consumer and auto.
• Efficient Power Conversion — Gallium-nitride (GaN) power transistors and integrated circuits.
• Egis Technology — Fingerprint sensor and security IC designer.
• Fuji Electric — Major IGBT and power module maker for industry and rail.
• Goodix Technology — Fingerprint sensor and touch controller supplier to Android phones.
• Guerrilla RF, Inc. — Greensboro, NC fabless RF/microwave (MMIC) supplier; LNAs, gain blocks, switches, attenuators and PAs.
• Knowles — MEMS microphones and acoustic and capacitor components.
• Littelfuse — Circuit protection leader with growing power semiconductor line.
• Lotes Co. — Precision connector maker specializing in CPU sockets, memory connectors and I/O connectors.
• MACOM Technology — RF, microwave and photonic semiconductors for telecom and defense.
• Maxscend Microelectronics — Chinese RF front-end chip designer.
• Melexis — Automotive mixed-signal sensor IC specialist.
• Mitsubishi Electric — Power module heavyweight in industrial, rail and SiC.
• Molex — Electronic, electrical and fiber-optic connector maker; wholly owned subsidiary of Koch Industries since 2013.
• Monolithic Power Systems — Fabless high-performance power management IC designer; key in AI servers.
• Murata Manufacturing — World leader in RF filters, modules and MLCC components.
• Navitas Semiconductor — Fabless GaN and SiC power IC designer.
• Nexperia — High-volume discretes maker (ex-NXP unit); Wingtech-owned, under Dutch oversight.
• Nichicon — One of the world's top makers of aluminum electrolytic and conductive-polymer capacitors.
• Nippon Chemi-Con — One of the world's top makers of aluminum electrolytic capacitors and capacitor materials (electrode foils).
• NOVOSENSE Microelectronics — Chinese analog and sensor IC challenger in auto and industrial.
• Power Integrations — Leader in high-voltage AC-DC conversion ICs.
• Qorvo — RF front-end and defense GaN supplier.
• Rubycon Corporation — Privately held Japanese maker of electrolytic and film capacitors and switching power-supply units.
• Samtec — Privately held maker of high-speed board-to-board connectors, cable assemblies and optical interconnects.
• Sanken Electric — Japanese power semiconductor and power IC maker.
• Semikron Danfoss — Power-semiconductor modules for industrial drives and EVs.
• SemiQ Inc. — Lake Forest, CA maker of SiC power semiconductors and 150mm SiC epitaxial wafers for high-voltage uses.
• Sensirion — Environmental and flow sensor solutions.
• SG Micro — Chinese analog IC designer in power management and signal chain.
• Silergy — Leading China-based analog and power management IC designer.
• Sino Wealth Electronic — Chinese MCU and mixed-signal chip designer.
• SiTime — Leader in MEMS-based timing devices replacing quartz oscillators.
• Skyworks Solutions — RF front-end module maker for smartphones; large Apple exposure.
• StarPower Semiconductor — Chinese IGBT and power module maker.
• TagoreTech (Tagore Technology) — US fabless GaN-on-Si RF specialist (Arlington Heights, IL); switches, LNAs and PA modules for 5G.
• Taiyo Yuden — Leading maker of MLCCs and inductors.
• TDK — Electronic components maker; SAW filters, MLCCs, and MEMS sensors.
• TE Connectivity — Maker of connectors and sensors for harsh environments, serving automotive, industrial, aerospace/defense and communications customers.
• Vicor — Modular power-conversion components for AI servers and industry.
• Vishay Intertechnology — Broadline discrete semiconductor and passive component maker.
• VisIC Technologies — Israeli fabless developer of high-voltage GaN power devices (D3GaN) for EV inverters and data centers.
• Walsin Technology — Major MLCC and chip-resistor manufacturer.
• Will Semiconductor (OmniVision) — Owner of OmniVision, a top-three CMOS image sensor designer.
• Yageo — World's top chip-resistor maker and a leading MLCC supplier.
• Yangzhou Yangjie Electronic — Chinese discrete and power semiconductor maker.

IDM

• Analog Devices — High-performance analog leader: converters, amplifiers, power.
• BYD Semiconductor — BYD's chip arm; automotive IGBTs and SiC power devices.
• China Resources Microelectronics — China's largest power-focused integrated device manufacturer.
• Infineon Technologies — World's top power semiconductor maker; strong in auto and SiC/GaN.
• Innoscience — World's largest GaN power device maker, an integrated manufacturer.
• Intel — x86 CPU IDM building an external foundry business on 18A and beyond.
• Magnachip Semiconductor — Display driver and power IDM with analog mixed-signal heritage.
• Microchip Technology — MCU and analog IDM with broad industrial catalog and FPGA line.
• NXP Semiconductors — Automotive and edge processing IDM: MCUs, radar, secure connectivity.
• onsemi — Power and sensing IDM; top-two in SiC and auto image sensors.
• Pragmatic Semiconductor — UK maker of ultra-low-cost flexible thin-film chips.
• Renesas Electronics — Japanese MCU and analog IDM focused on automotive and industrial.
• Robert Bosch — Top automotive MEMS sensor maker with growing SiC fab capacity.
• ROHM — Japanese power and analog IDM; early mover in SiC devices.
• Samsung Electronics — World's largest memory maker, plus leading-edge foundry and Exynos design.
• Silan Microelectronics — Chinese power and analog integrated device manufacturer.
• Sony Semiconductor Solutions — Dominant CMOS image sensor maker for smartphones and cameras.
• STMicroelectronics — European IDM spanning MCUs, sensors, analog and SiC power.
• Texas Instruments — Largest analog chipmaker, manufacturing on its own 300mm fabs.
• Toshiba — Power semiconductor and storage group; taken private by JIP in 2023.
• Wolfspeed — SiC wafer and device pure-play; restructured through Chapter 11 in 2025.

Memory

• ADATA Technology — Memory module and SSD maker.
• Apacer Technology — Industrial-grade memory modules and solid-state drives.
• ChangXin Memory (CXMT) — China's domestic DRAM champion, scaling DDR5 and early HBM.
• Everspin Technologies — Commercial MRAM maker for industrial and aerospace.
• Ferroelectric Memory Company — FeFET ferroelectric non-volatile memory IP.
• Giantec Semiconductor — Chinese EEPROM and mixed-signal chip designer.
• GigaDevice Semiconductor — Top-three NOR flash vendor and Chinese MCU designer.
• Innodisk — Industrial-grade memory and embedded storage maker.
• Integrated Silicon Solution — Specialty DRAM and SRAM for automotive, industrial, and comms.
• Kingston Technology — World's largest independent DRAM module and SSD maker.
• Kioxia Holdings — NAND inventor (ex-Toshiba Memory); operates JV fabs with SanDisk.
• Macronix International — Leading NOR flash and ROM maker.
• Micron Technology — Only US-based DRAM/NAND maker; ramping HBM for AI accelerators.
• Nanya Technology — Taiwanese DRAM maker focused on specialty and consumer DRAM.
• NetApp — Enterprise storage systems and data-management software vendor (ONTAP, all-flash arrays) for on-premises and cloud data centers.
• Netlist — Memory-module maker and memory-technology IP licensor.
• Phison Electronics — Leading NAND flash controller and storage-solution designer.
• SanDisk — NAND and SSD maker spun out of Western Digital in 2025.
• Seagate Technology Holdings — Hard disk drive maker; one of two dominant HDD suppliers to hyperscale and enterprise data centers.
• Shenzhen Longsys Electronics — NAND/DRAM module maker; owner of the Lexar consumer-storage brand (acquired from Micron) and FORESEE industrial-storage brand.
• Silicon Motion — Leading NAND controller designer for SSDs and embedded storage.
• SK hynix — HBM leader supplying NVIDIA; top-two in DRAM, owns Solidigm NAND.
• SMART Modular Technologies — Specialty memory modules and storage (Penguin Solutions).
• Solidigm — NAND flash and enterprise SSD maker, an SK Hynix subsidiary.
• Team Group — Memory module and storage products maker.
• Transcend Information — Memory module, flash, and embedded storage maker.
• Weebit Nano — ReRAM (resistive RAM) non-volatile memory IP developer.
• Western Digital — Hard disk drive maker; refocused on HDDs after spinning off its NAND/flash business as SanDisk in February 2025.
• Winbond Electronics — Specialty memory maker: NOR flash and niche DRAM.
• Yangtze Memory (YMTC) — China's NAND flash champion with Xtacking architecture.

Foundry

• DB HiTek — Korean 200mm analog and power specialty foundry.
• GlobalFoundries — Largest US-based pure-play foundry, focused on specialty nodes.
• Hua Hong Semiconductor — China's second foundry, specialty and power-focused.
• Nexchip Semiconductor — Chinese specialty foundry for display drivers and image sensors.
• Polar Semiconductor — US specialty analog and power semiconductor foundry.
• Powerchip (PSMC) — Taiwanese foundry spanning memory and logic specialty processes.
• Rapidus — Government-backed Japanese foundry targeting 2nm production in 2027.
• SkyWater Technology — US specialty foundry with DARPA-trusted domestic manufacturing.
• SMIC — China's largest foundry, pushing advanced nodes despite export controls.
• Tower Semiconductor — Specialty analog foundry: RF-SOI, SiGe, sensors, power.
• TSMC — World's dominant foundry, manufacturing nearly all leading-edge chips.
• United Microelectronics (UMC) — Taiwan's second foundry, strong in mature and specialty nodes.
• Vanguard International (VIS) — TSMC-affiliated specialty foundry for display drivers and power.
• Win Semiconductors — World's largest GaAs RF foundry.
• X-FAB — European analog/mixed-signal and SiC specialty foundry.

OSAT

• Amkor Technology — Second-largest OSAT; building advanced packaging capacity in Arizona.
• ASE Technology — World's largest OSAT, includes SPIL; key advanced packaging partner.
• Chipbond Technology — Display-driver IC bumping, COG, and gold-bump packaging and test leader.
• ChipMOS Technologies — OSAT focused on display driver and memory packaging/test.
• Deca Technologies — Independent licensor of M-Series fan-out wafer-level packaging with Adaptive Patterning die-shift correction.
• Greatek Electronics — Taiwanese OSAT specializing in memory and logic packaging.
• Hana Micron — Korean OSAT serving Samsung and SK hynix memory packaging.
• Huatian Technology — Top-three Chinese OSAT provider.
• Integra Technologies — US OSAT for high-reliability and defense applications.
• JCET Group — China's largest OSAT (includes former STATS ChipPAC).
• King Yuan Electronics (KYEC) — Largest dedicated test house; heavy AI GPU test exposure.
• LB Semicon — Korean OSAT focused on display driver packaging.
• Lingsen Precision — Taiwanese outsourced assembly and test provider.
• Nepes — Korean OSAT specializing in fan-out advanced packaging.
• Orient Semiconductor (OSE) — Taiwanese outsourced assembly and test provider.
• Powertech Technology (PTI) — Memory-focused OSAT leader in Taiwan.
• SFA Semicon — Korean OSAT, the former STS Semiconductor.
• Sigurd Microelectronics — Taiwanese IC final-test and assembly provider.
• Tongfu Microelectronics — Chinese OSAT and AMD's main packaging partner via JV fabs.
• Unisem — Malaysian OSAT providing chip assembly and test services.
• UTAC Holdings — Singapore-based OSAT for analog and mixed-signal devices.
• Walton Advanced Engineering — Memory and logic packaging and test services.

Distribution & Misc

• Accelink Technologies — Chinese optical component and transceiver maker.
• Aeva Technologies — FMCW lidar-on-chip sensors for automotive and industrial use.
• Applied Optoelectronics — Optical transceiver and component maker.
• Arrow Electronics — Global electronic component distributor and supply chain services.
• Avicena Tech Corp. — Sunnyvale startup pioneering low-power microLED-based optical interconnects for chip-to-chip AI links.
• Avnet — Global distributor with strong design-chain services.
• Ayar Labs — Co-packaged optical I/O chiplets for AI compute interconnect.
• Benchmark Electronics — Electronics manufacturing services provider specializing in aerospace/defense, medical, industrial and semiconductor-capital-equipment customers.
• Celestial AI — Optical interconnect (Photonic Fabric) startup for AI; being acquired by Marvell (definitive agreement announced, expected close ~Q1 CY2026).
• Celestica — EMS/ODM supplier of data-center hardware and AI systems.
• Coherent — Photonics conglomerate: optical transceivers, lasers, SiC materials.
• Compal Electronics — Taiwanese ODM; world's #2 notebook-PC manufacturer, increasingly building AI servers.
• Corning Incorporated — Optical fiber, cable, and glass materials maker; top global producer of optical fiber for AI data center interconnect and a first-mover in glass-core substrates for advanced chip packaging.
• DigiKey — Large catalog distributor of electronic components.
• EFFECT Photonics — Eindhoven fabless coherent-transceiver company delivering compact InP coherent modules for metro and DCI.
• Eoptolink Technology — Optical transceiver maker for AI data centers.
• Fabrinet — Contract manufacturer of optical and photonic components.
• Flex Ltd. — Electronics manufacturing services (EMS)/ODM provider; builds data-center power and liquid-cooling hardware, including JetCool technology acquired in 2024, alongside contract manufacturing.
• Furukawa Electric — Optical fiber, components, and electronic materials maker.
• Gigabyte Technology — Server, GPU, and motherboard maker for AI and data centers.
• Hamamatsu Photonics — Leading maker of photonic devices, sensors, and light sources.
• Hon Hai (Foxconn) — World's largest electronics contract manufacturer; builds AI servers.
• InnoLight Technology — Leading optical transceiver maker for AI data centers.
• Inspur — Chinese server and AI-system maker.
• Inventec — Server and AI-system ODM for cloud data centers.
• Jabil — Global EMS manufacturer building electronics and data-center hardware.
• Lenovo — Global PC and server maker; ISG builds AI servers.
• Lightmatter — Photonic interconnect and compute startup for AI data centers.
• Lumentum Holdings — Optical components and lasers for datacom transceivers and 3D sensing.
• Luxshare Precision Industry — Began as a connector/cable maker, now Apple's largest China-based components supplier and assembler of AirPods, Apple Watch and iPhone.
• Macnica Holdings — Japan's largest semiconductor distributor.
• Mouser Electronics — Catalog distributor of semiconductors and components, owned by TTI.
• nLight — Semiconductor and fiber laser maker.
• OpenLight Photonics, Inc. — Silicon photonics IP company licensing integrated laser-on-silicon PDKs for AI datacenter interconnects.
• PDF Solutions — Yield analytics and process control software for fabs.
• Pegatron — Electronics ODM for computing, networking, and servers.
• Plexus Corp. — Electronics manufacturing services provider focused on complex, regulated products for healthcare, aerospace/defense and industrial customers.
• POET Technologies — Optical interposer and engine maker for transceivers.
• Quanta Computer — Top ODM building AI servers for hyperscalers.
• Ranovus Inc. — Ottawa CPO startup with the monolithic ODIN electro-photonic chip platform for AI datacenter interconnects.
• Rutronik — European electronic component distributor.
• Sanmina Corporation — Electronics manufacturing services (EMS) provider; acquired AMD's ZT Systems data-center infrastructure manufacturing business in October 2025.
• Sondrel — Custom SoC design and turnkey ASIC services (renamed Aion Silicon, April 2025).
• Source Photonics — Optical transceivers for data-center and telecom networks.
• Sumitomo Electric Industries — Optical fiber, compound-semiconductor devices, and EV power modules.
• Supreme Electronics — Taiwanese electronic-component distributor.
• TTI, Inc. — Specialty distributor of passive, connector, and electromechanical parts.
• Weikeng Industrial — Asia-Pacific semiconductor and component distributor.
• Wistron — Taiwanese ODM building servers and AI systems for hyperscalers.
• Wiwynn — Hyperscale AI server and storage ODM (Wistron group).
• WPG Holdings — World's largest semiconductor component distributor.
• WT Microelectronics — Major Asian semiconductor distributor that acquired Future Electronics.

AI & Data Center

• 21Vianet — Chinese carrier-neutral data-center and cloud operator.
• AAON — Manufactures HVAC and liquid cooling systems for data centers under its BASX brand, which grew 72% year over year in Q1 2026 on data-center cooling demand.
• ABB Ltd — Supplies electrification equipment for data centers, including switchgear, power distribution units, and solid-state medium-voltage UPS systems.
• Accton Technology Corporation — Taiwan ODM/OEM of data-center and enterprise switches, including 400G AI/ML white-box fabrics.
• AI21 Labs — Israeli AI lab building enterprise language models.
• AirTrunk — Asia-Pacific hyperscale data-center operator (Blackstone owned).
• Alibaba Group — Chinese cloud leader; T-Head designs Yitian CPUs and Hanguang AI chips.
• Aligned Data Centers — Hyperscale data-center operator with adaptive liquid cooling.
• American Tower — Communications-infrastructure REIT; owns CoreSite data centers.
• Anthropic — AI safety lab building the Claude models; runs on TPUs, Trainium, and GPUs.
• Applied Digital — AI data-center developer and GPU cloud (HPC hosting) provider.
• Arista Networks — High-speed data-center switching for AI back-end networks.
• Asetek — Liquid-cooling technology for high-performance computing; taken private via compulsory redemption by CQXA and removed from Nasdaq Copenhagen in May 2026.
• Asia Vital Components Co., Ltd. — Taiwanese thermal-solutions maker: fans, heat sinks, vapor chambers and liquid cooling for AI servers.
• Baidu — Chinese AI and cloud leader; designs Kunlun AI accelerators.
• Bit Digital — GPU cloud (WhiteFiber) and digital-asset infrastructure operator.
• Bitdeer Technologies — Data-center operator and ASIC maker for AI/HPC and bitcoin mining.
• Bloom Energy — Manufactures solid oxide fuel cells deployed as on-site power sources for AI data centers, with supply agreements including Oracle and Equinix.
• Caterpillar — Manufactures diesel and natural-gas generator sets and grid-forming battery energy storage systems for data-center backup and prime power.
• Chindata Group — Hyperscale data-center operator in China and emerging Asia (Bain Capital).
• Ciena — Optical networking and coherent transport for data-center interconnect.
• Cipher Mining — Data-center developer for HPC/AI and bitcoin mining.
• Cisco Systems — Networking giant supplying AI data-center switching and silicon.
• Cohere — Enterprise large-language-model developer.
• Cologix — North American interconnection and colocation operator.
• Colt Data Centre Services — Hyperscale data-center operator across Europe and Asia.
• Compass Datacenters — US build-to-suit hyperscale data-center developer.
• CoolIT Systems Inc. — Direct liquid cooling (DLC) systems and coolant distribution units for data centers and HPC.
• Core Scientific — Data-center operator hosting HPC/AI (incl. CoreWeave) and bitcoin mining.
• CoreSite — US interconnection and colocation operator (American Tower).
• CoreWeave — Largest pure-play GPU cloud (neocloud) renting NVIDIA capacity for AI.
• Crusoe Energy — Energy-first AI cloud building power-colocated GPU data centers.
• Cummins — Manufactures diesel and natural-gas backup generator sets for data centers.
• CyrusOne — Global hyperscale data-center operator (KKR/GIP owned).
• DataBank — US enterprise colocation and edge data-center operator.
• Dell Technologies — Top AI server and infrastructure systems integrator.
• Delta Electronics — Power supplies, cooling, and power management for data centers and EVs.
• Digital Realty — Global data-center REIT; major hyperscale and AI capacity provider.
• DigitalBridge — Digital-infrastructure investment manager owning DC and tower platforms.
• DriveNets Ltd. — Israeli firm providing disaggregated Network Cloud software and Ethernet AI fabric on white-box hardware.
• Eaton — Electrical power management and data-center power infrastructure.
• EdgeConneX — Global hyperscale and edge data-center developer.
• Emerson Electric — Supplies automation, measurement, and control systems for data-center power and cooling infrastructure, including DCIM and building management software.
• Equinix — World's largest data-center and interconnection REIT.
• Flexential — US colocation and hybrid-IT data-center operator.
• Fluidstack — Builds and operates AI data centers, including power acquisition, for large-scale AI compute.
• FSP Technology Inc. — Taiwanese FSP Group power-supply maker producing server PSUs (CRPS), UPS and battery backup units.
• Galaxy Digital — Crypto financial firm developing the Helios AI data-center campus.
• GDS Holdings — Leading Chinese data-center developer and operator.
• GE Vernova — Manufactures power transformers, grid switchgear, and gas turbines that connect AI data centers to the electrical grid.
• Generac Holdings — Manufactures diesel and natural-gas backup generators for data centers, including a global supply agreement with a hyperscale data-center operator.
• Global Switch — Large carrier-neutral data-center operator in Europe and Asia-Pacific.
• Hammond Power Solutions — Manufactures dry-type distribution transformers for the North American market.
• Hewlett Packard Enterprise — Enterprise servers, HPC, and AI systems (incl. Cray).
• Hitachi Energy — Manufactures power transformers and grid-to-rack power conversion equipment for data centers; a wholly owned subsidiary of Hitachi Ltd, headquartered in Zurich.
• HIVE Digital Technologies — Data-center operator for AI/HPC (Buzz HPC) and bitcoin mining.
• Huawei — Chinese networking and cloud giant; Ascend AI accelerators via HiSilicon.
• Hubbell Incorporated — Supplies electrical products for data centers, including power distribution units, cable management, and structured cabling, through its Electrical and Utility Solutions segments.
• Hugging Face — Open-source AI model hub and machine-learning platform.
• Hut 8 — Energy-infrastructure and data-center operator for AI/HPC and bitcoin.
• IBM — Enterprise computing and cloud; designs its own Power and Telum chips.
• IREN — Builds and operates data centers for AI compute and bitcoin mining.
• Iron Mountain — Records-management REIT with a fast-growing data-center business.
• Johnson Controls International plc — Manufactures YORK-brand chillers for data-center cooling and has invested in liquid-cooling technology company Accelsius.
• Juniper Networks — Networking systems and AI-driven data-center switching and routing.
• Keppel DC REIT — Asia-Pacific data-center REIT.
• Lambda — GPU cloud and AI workstation provider for training and inference.
• Legrand SA — Supplies power distribution and control equipment for data centers, including rack PDUs and busway, through its Data, Power and Control division.
• Lite-On Technology — Power supplies and optoelectronics for servers and electronics.
• Mistral AI — European AI lab building open-weight foundation models.
• Modine Manufacturing — Manufactures data-center cooling systems, including chillers and liquid cooling, under its Airedale by Modine brand, and secured a $4 billion long-term capacity agreement in 2026.
• Munters Group — Air treatment and data-center cooling systems.
• Nebius Group — AI-focused GPU cloud spun out of Yandex; full-stack neocloud.
• New H3C — Chinese networking, server, and AI-infrastructure provider.
• NEXTDC — Australian hyperscale data-center operator.
• Nokia — Telecom and data-center networking systems and optical transport.
• Nscale — AI GPU cloud and data-center operator.
• NTT — Japanese telecom giant; NTT Global Data Centers is a top-five operator.
• nVent Electrical — Electrical connection, protection, and liquid-cooling enclosures.
• OpenAI — Leading AI lab (ChatGPT); designing custom inference silicon with Broadcom.
• Oracle — Enterprise software giant; OCI is a fast-growing AI cloud renting GPUs.
• Parker Hannifin — Manufactures liquid-cooling quick disconnects, sensors, and fluid-transfer components for data-center thermal management systems.
• Perplexity AI — AI-powered answer engine and search company.
• Powell Industries — Manufactures medium- and low-voltage switchgear for data centers, including electrical substations, and holds a $1.6 billion order backlog driven partly by data-center wins.
• Pure Storage — All-flash storage systems for AI and enterprise data centers.
• QTS Data Centers — US hyperscale data-center operator owned by Blackstone.
• Quanta Services — Provides electrical engineering, procurement and construction (EPC) services for data-center power infrastructure, including transmission lines and substations.
• Rittal — Manufactures IT enclosures, racks, and cooling systems for data centers; the world's largest enclosure manufacturer, privately held as part of the family-owned Friedhelm Loh Group.
• Sabey Data Centers — US hyperscale and enterprise data-center developer and operator.
• Scale AI — Data-labeling and AI infrastructure for model training.
• Schneider Electric — Energy management and data-center power/cooling infrastructure.
• Siemens Energy AG — Manufactures power transformers and grid technology for data-center power connections, and is investing $1 billion to expand US grid-equipment manufacturing.
• Sify Technologies — Indian data-center, network, and cloud-services operator.
• Soluna Holdings — Green data centers co-located with renewable power for AI/HPC.
• STACK Infrastructure — Global hyperscale data-center platform (IPI Partners).
• STULZ — Manufactures precision air conditioning and liquid cooling systems for data centers; a privately held, family-owned company headquartered in Hamburg.
• Submer Technologies S.L. — Single-phase immersion cooling solutions for HPC, hyperscale and AI data centers.
• Super Micro Computer — AI server and liquid-cooled rack systems builder.
• Switch — US hyperscale data-center operator (DigitalBridge/IFM owned).
• Tencent — Chinese internet and cloud giant developing in-house AI silicon.
• TeraWulf — Operator of data centers for AI/HPC hosting and bitcoin mining.
• Together AI — GPU cloud and inference platform for open models.
• Trane Technologies plc — Manufactures chillers and liquid cooling systems for data centers, including a thermal management reference design co-developed with NVIDIA, and acquired liquid-cooling company LiquidStack in 2026.
• Vantage Data Centers — Global hyperscale data-center developer and operator.
• VAST Data — AI data platform and storage software for large GPU clusters.
• Vertiv — Leading data-center power and liquid-cooling systems maker.
• Voltage Park — GPU cloud provider for AI training and inference.
• xAI — Elon Musk's AI lab (Grok); operates the Colossus GPU supercluster.
• Yondr — Global hyperscale data-center developer and operator.
• ZTE — Chinese telecom-equipment maker; designs chips via its Sanechips unit.