OSAT companies
22 companies in the OSAT part of the semiconductor & AI value chain — Outsourced semiconductor assembly and test (OSAT) companies package finished dies into the chips and modules that go into end products. As advanced packaging — chiplets, CoWoS, HBM stacking, and fan-out technologies — moves from niche to mainstream, OSATs have become strategic partners rather than commodity handlers. ASE Technology (which includes SPIL) is the world's largest OSAT; Amkor is a major player in advanced packaging in the Americas and Korea. TSMC and Samsung also offer advanced packaging in-house, competing directly with OSATs at the leading edge.
Subsegments
Market share
Companies
- ASE Technology — World's largest OSAT, includes SPIL; key advanced packaging partner.
- JCET Group — China's largest OSAT (includes former STATS ChipPAC).
- Tongfu Microelectronics — Chinese OSAT and AMD's main packaging partner via JV fabs.
- Amkor Technology — Second-largest OSAT; building advanced packaging capacity in Arizona.
- King Yuan Electronics (KYEC) — Largest dedicated test house; heavy AI GPU test exposure.
- Huatian Technology — Top-three Chinese OSAT provider.
- Powertech Technology (PTI) — Memory-focused OSAT leader in Taiwan.
- Chipbond Technology — Display-driver IC bumping, COG, and gold-bump packaging and test leader.
- Unisem — Malaysian OSAT providing chip assembly and test services.
- Deca Technologies — Independent licensor of M-Series fan-out wafer-level packaging with Adaptive Patterning die-shift correction.
- Sigurd Microelectronics — Taiwanese IC final-test and assembly provider.
- Greatek Electronics — Taiwanese OSAT specializing in memory and logic packaging.
- ChipMOS Technologies — OSAT focused on display driver and memory packaging/test.
- Orient Semiconductor (OSE) — Taiwanese outsourced assembly and test provider.
- SFA Semicon — Korean OSAT, the former STS Semiconductor.
- Nepes — Korean OSAT specializing in fan-out advanced packaging.
- LB Semicon — Korean OSAT focused on display driver packaging.
- Lingsen Precision — Taiwanese outsourced assembly and test provider.
- Hana Micron — Korean OSAT serving Samsung and SK hynix memory packaging.
- Integra Technologies — US OSAT for high-reliability and defense applications.
- UTAC Holdings — Singapore-based OSAT for analog and mixed-signal devices.
- Walton Advanced Engineering — Memory and logic packaging and test services.
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