wafergraph — the semiconductor & AI supply-chain graph
A free, current, neutral map of the semiconductor & AI supply chain: 531+ companies across the full value chain (materials → equipment → EDA/IP → chip design → foundry → memory → packaging → distribution → AI & data center), with financials, supply-chain dependencies, market share, and chokepoint exposure.
Value-chain segments
Explore
Market share 2026
- Lithography market share — led by ASML at 89% (HHI 7,986)
- Pure-Play Foundry market share — led by TSMC at 62% (HHI 4,060)
- DRAM market share — led by Samsung Electronics at 41% (HHI 3,321)
- NAND market share — led by Samsung Electronics at 33% (HHI 2,167)
- HBM market share — led by SK hynix at 52% (HHI 4,248)
- GPU & AI Accelerators market share — led by NVIDIA at 88% (HHI 7,808)
- Mobile SoC market share — led by MediaTek at 35% (HHI 2,247)
- FPGA market share — led by AMD at 49% (HHI 3,395)
- EDA Software market share — led by Synopsys at 32% (HHI 2,093)
- Silicon Wafers market share — led by Shin-Etsu Chemical at 28% (HHI 1,758)
- Outsourced Assembly & Test market share — led by ASE Technology at 27% (HHI 1,143)
- Analog & Mixed Signal market share — led by Texas Instruments at 19% (HHI 735)
- Power Semiconductors (incl. SiC, GaN) market share — led by Infineon Technologies at 21% (HHI 672)
- Passive Components (MLCC, resistors, inductors) market share — led by Murata Manufacturing at 31% (HHI 1,613)
- Substrates market share — led by Unimicron at 25% (HHI 1,418)
- Photonics & Optics market share — led by InnoLight Technology at 28% (HHI 1,127)
- Data Center Operators (Colo) market share — led by Equinix at 13% (HHI 294)
Major companies
- Amazon (Annapurna Labs) — Designs Graviton CPUs and Trainium AI chips for AWS via Annapurna Labs.
- Apple — Designs A/M-series SoCs and modems for its own devices; TSMC's largest customer.
- Alphabet (Google) — Designs TPU AI accelerators and Tensor phone SoCs for internal use.
- Microsoft — Designs Maia AI accelerators and Cobalt server CPUs for Azure.
- Hon Hai (Foxconn) — World's largest electronics contract manufacturer; builds AI servers.
- Samsung Electronics — World's largest memory maker, plus leading-edge foundry and Exynos design.
- NVIDIA — Dominant AI accelerator and GPU designer; also networking via Mellanox line.
- Meta Platforms — Designs MTIA inference accelerators for its own data centers.
- Alibaba Group — Chinese cloud leader; T-Head designs Yitian CPUs and Hanguang AI chips.
- Dell Technologies — Top AI server and infrastructure systems integrator.
- Tencent — Chinese internet and cloud giant developing in-house AI silicon.
- Robert Bosch — Top automotive MEMS sensor maker with growing SiC fab capacity.
- Tesla — Designs FSD and AI training chips for its vehicles and data centers.
- TSMC — World's dominant foundry, manufacturing nearly all leading-edge chips.
- Lenovo — Global PC and server maker; ISG builds AI servers.
- Sony Semiconductor Solutions — Dominant CMOS image sensor maker for smartphones and cameras.
- Wistron — Taiwanese ODM building servers and AI systems for hyperscalers.
- IBM — Enterprise computing and cloud; designs its own Power and Telum chips.
- Quanta Computer — Top ODM building AI servers for hyperscalers.
- Broadcom — Networking silicon leader and main designer of hyperscaler custom AI chips.
- SK hynix — HBM leader supplying NVIDIA; top-two in DRAM, owns Solidigm NAND.
- Galaxy Digital — Crypto financial firm developing the Helios AI data-center campus.
- Oracle — Enterprise software giant; OCI is a fast-growing AI cloud renting GPUs.
- Cisco Systems — Networking giant supplying AI data-center switching and silicon.
- Intel — x86 CPU IDM building an external foundry business on 18A and beyond.
- Schneider Electric — Energy management and data-center power/cooling infrastructure.
- Qualcomm — Leading smartphone SoC and modem designer, expanding into PC and auto.
- Micron Technology — Only US-based DRAM/NAND maker; ramping HBM for AI accelerators.
- WT Microelectronics — Major Asian semiconductor distributor that acquired Future Electronics.
- Mitsubishi Electric — Power module heavyweight in industrial, rail and SiC.
- ASML — Sole supplier of EUV lithography machines required for all leading-edge chips.
- Pegatron — Electronics ODM for computing, networking, and servers.
- AMD — x86 CPU and Instinct GPU designer; owns Xilinx FPGA franchise.
- Hewlett Packard Enterprise — Enterprise servers, HPC, and AI systems (incl. Cray).
- Linde — World's largest industrial gas company; major electronics gas business.
- Sumitomo Electric Industries — Optical fiber, compound-semiconductor devices, and EV power modules.
- WPG Holdings — World's largest semiconductor component distributor.
- Daikin Industries — Fluorochemicals maker supplying etch gases and coatings alongside HVAC.
- Air Liquide — Top industrial and electronic specialty gas supplier to fabs worldwide.
- Arrow Electronics — Global electronic component distributor and supply chain services.