Sumitomo Bakelite
Sumitomo Bakelite is a niche in the Materials segment of the semiconductor & AI supply chain, headquartered in Shinagawa ku, JP. Its key customers include TSMC, Samsung Electronics, Intel.
Semiconductor encapsulation resins and packaging materials.
- Ticker
- TSE: 4203
- Headquarters
- Shinagawa ku, JP
- Revenue
- $2.0B (FY2026) · +199.5% YoY
- Net income
- $171M
- Operating margin
- 11.3%
- Market position
- niche
- Value-chain segment
- Packaging Materials (Leadframes, Bonding Wire)
- Key products
- Epoxy mold compounds (EMC) for IC encapsulation, Liquid epoxy encapsulants for flip-chip packages, Underfill materials for advanced packaging, Wafer-level underfill films, High-reliability semiconductor sealing resins
About Sumitomo Bakelite
Sumitomo Bakelite, headquartered in Japan, operates in the Packaging Materials (Leadframes, Bonding Wire) segment of the semiconductor & AI supply chain and is positioned as a market niche there. Its key products include Epoxy mold compounds (EMC) for IC encapsulation, Liquid epoxy encapsulants for flip-chip packages, Underfill materials for advanced packaging, Wafer-level underfill films, High-reliability semiconductor sealing resins. wafergraph maps 7 tracked customers for Sumitomo Bakelite across the value chain. It has a supply-chain criticality score of 50/100, with 236 companies downstream of it.
Key products
- Epoxy mold compounds (EMC) for IC encapsulation
- Liquid epoxy encapsulants for flip-chip packages
- Underfill materials for advanced packaging
- Wafer-level underfill films
- High-reliability semiconductor sealing resins