Chang Wah Technology vs Tongfu Microelectronics
Tongfu Microelectronics is larger by market cap ($14.2B vs $2.2B). Chang Wah Technology's primary segment is Packaging Materials (Leadframes, Bonding Wire); Tongfu Microelectronics's is Outsourced Assembly & Test.
Side-by-side
| Chang Wah Technology | Tongfu Microelectronics | |
|---|---|---|
| Market cap | $2.2B | $14.2B |
| Revenue | — | $4.1B (FY2025) |
| Primary segment | Packaging Materials (Leadframes, Bonding Wire) | Outsourced Assembly & Test |
| Market position | major | major |
| Country | Taiwan | China |
| Tracked suppliers | 0 | 8 |
| Tracked customers | 13 | 6 |
| Chokepoint / criticality | 69/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chang Wah Technology and Tongfu Microelectronics compare
- Size: Tongfu Microelectronics is the larger company by market cap.
- Supply-chain criticality: Chang Wah Technology has the higher chokepoint score (69/100 vs 68/100).
- Footprint: Chang Wah Technology (Taiwan) vs Tongfu Microelectronics (China).