Element Solutions competitors

As of 2026-09-05, Element Solutions's closest competitors in Packaging Materials (Leadframes, Bonding Wire) are Mitsui High-tec, Kyocera and Sumitomo Metal Mining. wafergraph tracks 11 companies in Packaging Materials (Leadframes, Bonding Wire); Element Solutions is positioned as a market major there with a market cap of $8.8B, and the largest competitor by market cap is Kyocera at $28.6B.

Data as of 2026-09-05 · peers = companies sharing Element Solutions's primary Packaging Materials (Leadframes, Bonding Wire) segment in the wafergraph taxonomy · ordered by market position, then market cap

Who competes with Element Solutions

Customers Element Solutions shares with its competitors

  • TSMC shared with 8 of Element Solutions's top competitors
  • Samsung Electronics shared with 8 of Element Solutions's top competitors
  • Intel shared with 8 of Element Solutions's top competitors
  • SK hynix shared with 8 of Element Solutions's top competitors
  • Micron Technology shared with 8 of Element Solutions's top competitors
  • SMIC shared with 8 of Element Solutions's top competitors
  • GlobalFoundries shared with 8 of Element Solutions's top competitors

Cite as: wafergraph, “Element Solutions competitors — 10 rivals in Packaging Materials (Leadframes, Bonding Wire), compared”, https://wafergraph.com/competitors/element_solutions (data as of 2026-09-05).

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