Haesung DS competitors

As of 2026-09-05, Haesung DS's closest competitors in Packaging Materials (Leadframes, Bonding Wire) are Mitsui High-tec, Kyocera and Sumitomo Metal Mining. wafergraph tracks 11 companies in Packaging Materials (Leadframes, Bonding Wire); Haesung DS is positioned as a market niche there with a market cap of $630M, and the largest competitor by market cap is Kyocera at $28.6B.

Data as of 2026-09-05 · peers = companies sharing Haesung DS's primary Packaging Materials (Leadframes, Bonding Wire) segment in the wafergraph taxonomy · ordered by market position, then market cap

Who competes with Haesung DS

Customers Haesung DS shares with its competitors

  • TSMC shared with 8 of Haesung DS's top competitors
  • Samsung Electronics shared with 8 of Haesung DS's top competitors
  • Intel shared with 8 of Haesung DS's top competitors
  • SK hynix shared with 8 of Haesung DS's top competitors
  • Micron Technology shared with 8 of Haesung DS's top competitors
  • SMIC shared with 8 of Haesung DS's top competitors
  • GlobalFoundries shared with 8 of Haesung DS's top competitors

Cite as: wafergraph, “Haesung DS competitors — 10 rivals in Packaging Materials (Leadframes, Bonding Wire), compared”, https://wafergraph.com/competitors/haesung_ds (data as of 2026-09-05).

Open Haesung DS in the interactive supply-chain view →

Track the chain

What moved in the semiconductor supply chain — This Week in the Chain, the free weekly wafergraph briefing.

Subscribe to the free weekly briefing →

Free · no login · 615 companies, updated weekly