DISCO

DISCO is a leader in the Equipment (Back End) segment of the semiconductor & AI supply chain, headquartered in Japan. Its key suppliers include Hamamatsu Photonics. Its key customers include ASE Technology, Amkor Technology, TSMC.

Controls most of the market for wafer dicing and grinding equipment.

Ticker
TSE: 6146
Headquarters
Japan
Revenue
$2.7B (FY2026) · +11.1% YoY
Net income
$828M
Operating margin
42.7%
Market position
leader
Value-chain segment
Assembly & Packaging Equipment
Key products
dicing saws, grinders, laser saws

About DISCO

DISCO, headquartered in Japan, operates in the Assembly & Packaging Equipment segment of the semiconductor & AI supply chain and is positioned as a market leader there. Its key products include dicing saws, grinders, laser saws. wafergraph maps 1 tracked supplier and 9 tracked customers for DISCO across the value chain. It has a supply-chain criticality score of 81/100, with 235 companies downstream of it.

Key products

  • dicing saws
  • grinders
  • laser saws

Suppliers

Customers

More Equipment (Back End) companies

Sources

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