ASE Technology

ASE Technology is a leader in the OSAT segment of the semiconductor & AI supply chain, headquartered in Kaohsiung. Its key suppliers include Tokyo Electron, Advantest, Teradyne. Its key customers include NVIDIA, AMD, Qualcomm.

World's largest OSAT, includes SPIL; key advanced packaging partner.

Ticker
NYSE: ASX
Headquarters
Kaohsiung
Founded
1984
Revenue
$20.6B (FY2025) · +13.3% YoY
Net income
$1.3B
Operating margin
8.0%
Market position
leader
Value-chain segment
Outsourced Assembly & Test, Advanced Packaging Services
Key products
Advanced IC packaging (Fan-Out, Flip-Chip), SiP (System-in-Package) modules, Wire-bonding assembly and test, CoWoS substrate interposer assembly (with TSMC), Testing services (burn-in, final test)

About ASE Technology

ASE Technology, headquartered in Taiwan, operates in the Outsourced Assembly & Test and Advanced Packaging Services segments of the semiconductor & AI supply chain and is positioned as a market leader there. Its key products include Advanced IC packaging (Fan-Out, Flip-Chip), SiP (System-in-Package) modules, Wire-bonding assembly and test, CoWoS substrate interposer assembly (with TSMC), Testing services (burn-in, final test). wafergraph maps 20 tracked suppliers and 72 tracked customers for ASE Technology across the value chain. It has a supply-chain criticality score of 81/100, with 235 companies downstream of it.

Advanced Semiconductor Engineering, Inc., previously known as ASE Group, is a leading provider of independent semiconductor packaging and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.

Key products

  • Advanced IC packaging (Fan-Out, Flip-Chip)
  • SiP (System-in-Package) modules
  • Wire-bonding assembly and test
  • CoWoS substrate interposer assembly (with TSMC)
  • Testing services (burn-in, final test)

Suppliers

Customers

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Sources

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