Chipbond Technology vs Himax Technologies
Chipbond Technology is larger by market cap ($3.6B vs $2.6B). Himax Technologies reports higher tracked revenue ($832M vs $666M). Chipbond Technology's primary segment is Outsourced Assembly & Test; Himax Technologies's is Display ICs.
Side-by-side
| Chipbond Technology | Himax Technologies | |
|---|---|---|
| Market cap | $3.6B | $2.6B |
| Revenue | $666M (FY2025) | $832M (FY2025) |
| Primary segment | Outsourced Assembly & Test | Display ICs |
| Market position | major | niche |
| Country | Taiwan | Taiwan |
| Tracked suppliers | 0 | 5 |
| Tracked customers | 9 | 0 |
| Chokepoint / criticality | 68/100 | 0/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and Himax Technologies compare
- Size: Chipbond Technology is the larger company by market cap.
- Revenue: Himax Technologies reports higher tracked revenue.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 0/100).
- Footprint: Chipbond Technology (Taiwan) vs Himax Technologies (Taiwan).