Chipbond Technology
Chipbond Technology is a major in the OSAT segment of the semiconductor & AI supply chain, headquartered in Taiwan. Its key customers include Novatek Microelectronics, Himax Technologies, Fitipower.
Display-driver IC bumping, COG, and gold-bump packaging and test leader.
- Ticker
- TPEx: 6147
- Headquarters
- Taiwan
- Revenue
- $677M (FY2025) · +5.5% YoY
- Net income
- $88M
- Operating margin
- 19.3%
- Market position
- major
- Value-chain segment
- Outsourced Assembly & Test
- Key products
- Gold-bump wafer bumping for display driver ICs, Chip-on-Glass (COG) bonding, Flip-chip bumping and assembly, Tape Carrier Package (TCP) services, Known-good-die (KGD) test and sort
About Chipbond Technology
Chipbond Technology, headquartered in Taiwan, operates in the Outsourced Assembly & Test segment of the semiconductor & AI supply chain and is positioned as a market major there. Its key products include Gold-bump wafer bumping for display driver ICs, Chip-on-Glass (COG) bonding, Flip-chip bumping and assembly, Tape Carrier Package (TCP) services, Known-good-die (KGD) test and sort. wafergraph maps 9 tracked customers for Chipbond Technology across the value chain. It has a supply-chain criticality score of 68/100, with 236 companies downstream of it.
Role in the chain
Chipbond Technology is a market major in OSAT (Outsourced Assembly & Test), headquartered in Taiwan. Display-driver IC bumping, COG, and gold-bump packaging and test leader.
Diligence questions
- The dataset names 9 tracked customers for Chipbond Technology. How concentrated is demand among those names, and which of them have a documented second source in this graph?
- Chipbond Technology is headquartered in Taiwan. What jurisdiction, export-control or logistics risk sits at that HQ, versus at the fabs or plants the filings actually name?
- Chipbond Technology trades as TPEx:6147. What does the latest reported period say about capacity and backlog versus the graph position above?
- Before treating any edge as a verified relationship, check the provenance labels on the company page and the method note at /methodology.
Key products
- Gold-bump wafer bumping for display driver ICs
- Chip-on-Glass (COG) bonding
- Flip-chip bumping and assembly
- Tape Carrier Package (TCP) services
- Known-good-die (KGD) test and sort
Customers
More OSAT companies
Compare with
ASE Technology · JCET Group · Tongfu Microelectronics · Amkor Technology · King Yuan Electronics (KYEC) · Huatian Technology
Sources
Open the interactive supply-chain view →
Cite as: wafergraph, “Chipbond Technology — supply chain, financials & market position”, https://wafergraph.com/company/chipbond (data as of 2026-09-05).
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