Chipbond Technology vs LB Semicon
Both are primarily Outsourced Assembly & Test companies. Chipbond Technology is larger by market cap ($5.3B vs $240M).
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Side-by-side
| Chipbond Technology | LB Semicon | |
|---|---|---|
| Market cap | $5.3B | $240M |
| Revenue | $675M (FY2025) | — |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | niche |
| Country | Taiwan | South Korea |
| Tracked suppliers | 0 | 0 |
| Tracked customers | 9 | 6 |
| Chokepoint / criticality | 68/100 | 50/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-10-09. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and LB Semicon compare
- Size: Chipbond Technology is the larger company by market cap.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 50/100).
- Footprint: Chipbond Technology (Taiwan) vs LB Semicon (South Korea).
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Cite as: wafergraph, “Chipbond Technology vs LB Semicon”, https://wafergraph.com/compare/chipbond-vs-lb_semicon (data as of 2026-10-09).
Frequently asked questions3
- Is Chipbond Technology bigger than LB Semicon?
- Chipbond Technology is larger by market cap ($5.3B vs $240M).
- What's the difference between Chipbond Technology and LB Semicon?
- Chipbond Technology is a major in Outsourced Assembly & Test based in Taiwan; LB Semicon is a niche in Outsourced Assembly & Test based in South Korea. Both operate in the OSAT segment.
- Who are Chipbond Technology's and LB Semicon's suppliers?
- wafergraph tracks 0 suppliers for Chipbond Technology and 0 for LB Semicon.