Chipbond Technology vs Lingsen Precision
Chipbond Technology is larger by market cap ($3.6B vs $30M). Both are primarily Outsourced Assembly & Test companies.
Shared segment: OSAT.
Side-by-side
| Chipbond Technology | Lingsen Precision | |
|---|---|---|
| Market cap | $3.6B | $30M |
| Revenue | $666M (FY2025) | — |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | niche |
| Country | Taiwan | Taiwan |
| Tracked suppliers | 0 | 0 |
| Tracked customers | 9 | 6 |
| Chokepoint / criticality | 68/100 | 50/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and Lingsen Precision compare
- Size: Chipbond Technology is the larger company by market cap.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 50/100).
- Footprint: Chipbond Technology (Taiwan) vs Lingsen Precision (Taiwan).