Chipbond Technology vs Nepes

Both are primarily Outsourced Assembly & Test companies. Chipbond Technology is larger by market cap ($5.3B vs $570M).

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Side-by-side

Chipbond TechnologyNepes
Market cap$5.3B$570M
Revenue$675M (FY2025)—
Primary segmentOutsourced Assembly & TestOutsourced Assembly & Test
Market positionmajorniche
CountryTaiwanSouth Korea
Tracked suppliers01
Tracked customers96
Chokepoint / criticality68/10050/100

Market caps/revenue from the wafergraph dataset · data as of 2026-10-09. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.

How Chipbond Technology and Nepes compare

  • Size: Chipbond Technology is the larger company by market cap.
  • Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 50/100).
  • Footprint: Chipbond Technology (Taiwan) vs Nepes (South Korea).

Company hubs

Chipbond Technology · Nepes · OSAT segment

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Cite as: wafergraph, “Chipbond Technology vs Nepes”, https://wafergraph.com/compare/chipbond-vs-nepes (data as of 2026-10-09).

Frequently asked questions3
Is Chipbond Technology bigger than Nepes?
Chipbond Technology is larger by market cap ($5.3B vs $570M).
What's the difference between Chipbond Technology and Nepes?
Chipbond Technology is a major in Outsourced Assembly & Test based in Taiwan; Nepes is a niche in Outsourced Assembly & Test based in South Korea. Both operate in the OSAT segment.
Who are Chipbond Technology's and Nepes's suppliers?
wafergraph tracks 0 suppliers for Chipbond Technology and 1 for Nepes; Nepes's include Deca Technologies.