Chipbond Technology vs SFA Semicon
Chipbond Technology is larger by market cap ($3.6B vs $710M). Chipbond Technology reports higher tracked revenue ($666M vs $259M). Both are primarily Outsourced Assembly & Test companies.
Shared segment: OSAT.
Side-by-side
| Chipbond Technology | SFA Semicon | |
|---|---|---|
| Market cap | $3.6B | $710M |
| Revenue | $666M (FY2025) | $259M (FY2025) |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | niche |
| Country | Taiwan | South Korea |
| Tracked suppliers | 0 | 0 |
| Tracked customers | 9 | 6 |
| Chokepoint / criticality | 68/100 | 50/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and SFA Semicon compare
- Size: Chipbond Technology is the larger company by market cap.
- Revenue: Chipbond Technology reports higher tracked revenue.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 50/100).
- Footprint: Chipbond Technology (Taiwan) vs SFA Semicon (South Korea).