Chipbond Technology vs Tongfu Microelectronics
Tongfu Microelectronics is larger by market cap ($14.2B vs $3.6B). Tongfu Microelectronics reports higher tracked revenue ($4.1B vs $666M). Both are primarily Outsourced Assembly & Test companies.
Shared segment: OSAT.
Side-by-side
| Chipbond Technology | Tongfu Microelectronics | |
|---|---|---|
| Market cap | $3.6B | $14.2B |
| Revenue | $666M (FY2025) | $4.1B (FY2025) |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | major |
| Country | Taiwan | China |
| Tracked suppliers | 0 | 8 |
| Tracked customers | 9 | 6 |
| Chokepoint / criticality | 68/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and Tongfu Microelectronics compare
- Size: Tongfu Microelectronics is the larger company by market cap.
- Revenue: Tongfu Microelectronics reports higher tracked revenue.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 68/100).
- Footprint: Chipbond Technology (Taiwan) vs Tongfu Microelectronics (China).
Company hubs
Chipbond Technology · Tongfu Microelectronics · OSAT segment