What's the difference between Chipbond Technology and Tongfu Microelectronics?

Chipbond Technology is a major in Outsourced Assembly & Test based in Taiwan; Tongfu Microelectronics is a major in Outsourced Assembly & Test based in China. Both operate in the OSAT segment.

Who are Chipbond Technology's and Tongfu Microelectronics's suppliers?

wafergraph tracks 0 suppliers for Chipbond Technology and 8 for Tongfu Microelectronics.

Chipbond Technology vs Tongfu Microelectronics

Both are primarily Outsourced Assembly & Test companies. Tongfu Microelectronics is larger by market cap ($13.3B vs $5.3B). Tongfu Microelectronics reports higher tracked revenue ($4.2B vs $675M).

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Side-by-side

	Chipbond Technology	Tongfu Microelectronics
Market cap	$5.3B	$13.3B
Revenue	$675M (FY2025)	$4.2B (FY2025)
Primary segment	Outsourced Assembly & Test	Outsourced Assembly & Test
Market position	major	major
Country	Taiwan	China
Tracked suppliers	0	8
Tracked customers	9	6
Chokepoint / criticality	68/100	68/100

Market caps/revenue from the wafergraph dataset · data as of 2026-10-09. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.

How Chipbond Technology and Tongfu Microelectronics compare

Size: Tongfu Microelectronics is the larger company by market cap.
Revenue: Tongfu Microelectronics reports higher tracked revenue.
Supply-chain criticality: Both companies have the same chokepoint score (68/100).
Footprint: Chipbond Technology (Taiwan) vs Tongfu Microelectronics (China).

Company hubs

Chipbond Technology · Tongfu Microelectronics · OSAT segment

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Cite as: wafergraph, “Chipbond Technology vs Tongfu Microelectronics”, https://wafergraph.com/compare/chipbond-vs-tongfu (data as of 2026-10-09).

Frequently asked questions3

Is Chipbond Technology bigger than Tongfu Microelectronics?: Tongfu Microelectronics is larger by market cap ($13.3B vs $5.3B).
What's the difference between Chipbond Technology and Tongfu Microelectronics?: Chipbond Technology is a major in Outsourced Assembly & Test based in Taiwan; Tongfu Microelectronics is a major in Outsourced Assembly & Test based in China. Both operate in the OSAT segment.
Who are Chipbond Technology's and Tongfu Microelectronics's suppliers?: wafergraph tracks 0 suppliers for Chipbond Technology and 8 for Tongfu Microelectronics.