Chipbond Technology vs Unisem
Chipbond Technology is larger by market cap ($3.6B vs $1.9B). Chipbond Technology reports higher tracked revenue ($666M vs $458M). Both are primarily Outsourced Assembly & Test companies.
Shared segment: OSAT.
Side-by-side
| Chipbond Technology | Unisem | |
|---|---|---|
| Market cap | $3.6B | $1.9B |
| Revenue | $666M (FY2025) | $458M (FY2025) |
| Primary segment | Outsourced Assembly & Test | Outsourced Assembly & Test |
| Market position | major | major |
| Country | Taiwan | Malaysia |
| Tracked suppliers | 0 | 0 |
| Tracked customers | 9 | 7 |
| Chokepoint / criticality | 68/100 | 68/100 |
Market caps/revenue from the wafergraph dataset · data as of 2026-08-12. Criticality is a graph-derived chokepoint score (0–100). Coverage is partial; "Unpriced" means no reliable market cap.
How Chipbond Technology and Unisem compare
- Size: Chipbond Technology is the larger company by market cap.
- Revenue: Chipbond Technology reports higher tracked revenue.
- Supply-chain criticality: Chipbond Technology has the higher chokepoint score (68/100 vs 68/100).
- Footprint: Chipbond Technology (Taiwan) vs Unisem (Malaysia).