Chipbond Technology → Broadcom
As of 2026-09-05, Chipbond Technology is a tracked supplier of Broadcom. Chipbond Technology is a major in OSAT (headquartered in Taiwan); Broadcom is a leader in Design (Fabless) (headquartered in United States). Chipbond Technology has 9 tracked customers; Broadcom has 74 tracked suppliers.
Data as of 2026-09-05 · relationship type: tracked supplier → customer · both names resolve in companies.json · no dollar amount is shown unless it already sits on a company record, and none is invented here
Why this edge matters
Chipbond Technology (major in OSAT) is a tracked supplier of Broadcom (leader in Design (Fabless)). Display-driver IC bumping, COG, and gold-bump packaging and test leader. Networking silicon leader and main designer of hyperscaler custom AI chips. The edge is one of 74 tracked suppliers of Broadcom and one of 9 tracked customers of Chipbond Technology.
Source: derived from both company records and the counted edges.
The two companies
Chipbond Technology (supplier)
Display-driver IC bumping, COG, and gold-bump packaging and test leader.
Broadcom (customer)
Networking silicon leader and main designer of hyperscaler custom AI chips.
Other tracked suppliers of Broadcom
Other tracked customers of Chipbond Technology
Cite as: wafergraph, “Chipbond Technology → Broadcom — supplier relationship in the semiconductor supply chain”, https://wafergraph.com/relationship/chipbond/broadcom/ (data as of 2026-09-05).
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