Chipbond Technology competitors

As of 2026-09-05, Chipbond Technology's closest competitors in Outsourced Assembly & Test are ASE Technology, JCET Group and Tongfu Microelectronics. wafergraph tracks 21 companies in Outsourced Assembly & Test; Chipbond Technology is positioned as a market major there with a market cap of $4.3B, and the largest competitor by market cap is ASE Technology at $97.7B.

Data as of 2026-09-05 · peers = companies sharing Chipbond Technology's primary Outsourced Assembly & Test segment in the wafergraph taxonomy · ordered by market position, then market cap

Who competes with Chipbond Technology

Customers Chipbond Technology shares with its competitors

  • NVIDIA shared with 10 of Chipbond Technology's top competitors
  • AMD shared with 10 of Chipbond Technology's top competitors
  • Qualcomm shared with 10 of Chipbond Technology's top competitors
  • Broadcom shared with 10 of Chipbond Technology's top competitors
  • MediaTek shared with 10 of Chipbond Technology's top competitors
  • Apple shared with 10 of Chipbond Technology's top competitors
  • Novatek Microelectronics shared with 2 of Chipbond Technology's top competitors
  • Himax Technologies shared with 1 of Chipbond Technology's top competitors
  • Fitipower shared with 1 of Chipbond Technology's top competitors

Cite as: wafergraph, “Chipbond Technology competitors — 20 rivals in Outsourced Assembly & Test, compared”, https://wafergraph.com/competitors/chipbond (data as of 2026-09-05).

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