Packaging Materials (Leadframes, Bonding Wire) companies
9 companies in the Packaging Materials (Leadframes, Bonding Wire) part of the semiconductor & AI value chain.
Companies
- Mitsui High-tec — Leading leadframe maker and precision stamping specialist.
- Kyocera — Ceramic packages, substrates, and electronic components.
- Sumitomo Metal Mining — Materials maker supplying bonding wire, plating, and target metals.
- Element Solutions — Specialty chemicals for electronics assembly and advanced packaging.
- Chang Wah Technology — Leadframe and semiconductor packaging materials maker.
- Tanaka Precious Metals — Precious-metals group supplying bonding wire, plating, and targets.
- Sumitomo Bakelite — Semiconductor encapsulation resins and packaging materials.
- Haesung DS — Korean leadframe and package-substrate maker.
- MK Electron — Korean bonding-wire and solder-materials maker.
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