Tokyo Seimitsu (Accretech) competitors

As of 2026-09-05, Tokyo Seimitsu (Accretech)'s closest competitors in Assembly & Packaging Equipment are DISCO, ASMPT and TOWA. wafergraph tracks 7 companies in Assembly & Packaging Equipment; Tokyo Seimitsu (Accretech) is positioned as a market major there with a market cap of $4.4B, and the largest competitor by market cap is DISCO at $37.8B.

Data as of 2026-09-05 · peers = companies sharing Tokyo Seimitsu (Accretech)'s primary Assembly & Packaging Equipment segment in the wafergraph taxonomy · ordered by market position, then market cap

Who competes with Tokyo Seimitsu (Accretech)

Customers Tokyo Seimitsu (Accretech) shares with its competitors

  • TSMC shared with 6 of Tokyo Seimitsu (Accretech)'s top competitors
  • SK hynix shared with 6 of Tokyo Seimitsu (Accretech)'s top competitors
  • Samsung Electronics shared with 6 of Tokyo Seimitsu (Accretech)'s top competitors
  • Intel shared with 6 of Tokyo Seimitsu (Accretech)'s top competitors
  • Micron Technology shared with 6 of Tokyo Seimitsu (Accretech)'s top competitors
  • SMIC shared with 6 of Tokyo Seimitsu (Accretech)'s top competitors
  • GlobalFoundries shared with 6 of Tokyo Seimitsu (Accretech)'s top competitors
  • ASE Technology shared with 5 of Tokyo Seimitsu (Accretech)'s top competitors
  • Amkor Technology shared with 5 of Tokyo Seimitsu (Accretech)'s top competitors

Cite as: wafergraph, “Tokyo Seimitsu (Accretech) competitors — 6 rivals in Assembly & Packaging Equipment, compared”, https://wafergraph.com/competitors/tokyo_seimitsu (data as of 2026-09-05).

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