Tokyo Seimitsu (Accretech)

Tokyo Seimitsu (Accretech) is a major in the Equipment (Back End) segment of the semiconductor & AI supply chain, headquartered in Tokyo. Its key customers include TSMC, ASE Technology, Amkor Technology.

Wafer dicing, grinding, and metrology equipment maker.

Ticker
TSE: 7729
Headquarters
Tokyo
Founded
1949
Revenue
$1.0B (FY2026) · +10.8% YoY
Net income
$155M
Operating margin
16.1%
Market position
major
Value-chain segment
Assembly & Packaging Equipment, Metrology & Inspection
Key products
wafer dicing machines, wafer edge grinding machines

About Tokyo Seimitsu (Accretech)

Tokyo Seimitsu (Accretech), headquartered in Japan, operates in the Assembly & Packaging Equipment and Metrology & Inspection segments of the semiconductor & AI supply chain and is positioned as a market major there. Its key products include wafer dicing machines, wafer edge grinding machines. wafergraph maps 9 tracked customers for Tokyo Seimitsu (Accretech) across the value chain. It has a supply-chain criticality score of 68/100, with 236 companies downstream of it.

Role in the chain

Tokyo Seimitsu (Accretech) is a market major in Equipment (Back End) (Assembly & Packaging Equipment), headquartered in Japan. Wafer dicing, grinding, and metrology equipment maker.

Diligence questions

  1. The dataset names 9 tracked customers for Tokyo Seimitsu (Accretech). How concentrated is demand among those names, and which of them have a documented second source in this graph?
  2. Tokyo Seimitsu (Accretech) is headquartered in Japan. What jurisdiction, export-control or logistics risk sits at that HQ, versus at the fabs or plants the filings actually name?
  3. Tokyo Seimitsu (Accretech) trades as TSE:7729. What does the latest reported period say about capacity and backlog versus the graph position above?
  4. Before treating any edge as a verified relationship, check the provenance labels on the company page and the method note at /methodology.

Full diligence pack for Tokyo Seimitsu (Accretech)

Key products

  • wafer dicing machines
  • wafer edge grinding machines

Customers

More Equipment (Back End) companies

Compare with

Applied Materials · KLA · DISCO · Lasertec · Nordson · Zhongke Feice Technology

Sources

Open the interactive supply-chain view →

Cite as: wafergraph, “Tokyo Seimitsu (Accretech) — supply chain, financials & market position”, https://wafergraph.com/company/tokyo_seimitsu (data as of 2026-09-05).

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