Bonders companies
As of 2026-10-04, wafergraph tracks 5 Bonders companies across 4 countries; Hanmi Semiconductor, BE Semiconductor Industries, ASMPT, Kulicke & Soffa hold monopoly or leader positions. The largest by market cap is Hanmi Semiconductor at $19.2B, and the 4 priced companies total $52.0B.
Data as of 2026-10-04 · market caps from the daily wafergraph pipeline; unpriced companies are listed but not summed
5 companies in the Bonders part of the semiconductor & AI value chain.
Companies
- Hanmi Semiconductor — Korean leader in TC bonders used to stack HBM memory.
- BE Semiconductor Industries — Assembly equipment leader and front-runner in hybrid bonding.
- ASMPT — Largest back-end assembly and packaging equipment maker; TCB leader.
- Kulicke & Soffa — Dominant in wire bonders; expanding into advanced packaging.
- EV Group — Private Austrian leader in wafer bonding and litho for packaging.
Open the interactive Bonders view →
Cite as: wafergraph, “Bonders companies — list, suppliers & market position”, https://wafergraph.com/segment/equipment_back_end/bonders/ (data as of 2026-10-04).
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