Substrates companies
27 companies in the Substrates part of the semiconductor & AI value chain.
Market share
Companies
- Ajinomoto — Supplies effectively all ABF build-up film, the insulator in advanced CPU/GPU substrates.
- Corning Incorporated — Optical fiber, cable, and glass materials maker; top global producer of optical fiber for AI data center interconnect and a first-mover in glass-core substrates for advanced chip packaging.
- Unimicron — Largest Taiwanese ABF substrate maker serving major fabless customers.
- Ibiden — Leading IC package substrate maker; key supplier for Intel and AI packages.
- Soitec — Dominant supplier of engineered SOI substrates for RF and FD-SOI chips.
- Shengyi Technology — Copper-clad laminates and substrate materials for PCBs.
- Shennan Circuits — Chinese PCB and IC substrate maker.
- Kyocera — Ceramic packages, substrates, and electronic components.
- Nan Ya PCB — Formosa-group package substrate and PCB maker.
- Furukawa Electric — Optical fiber, components, and electronic materials maker.
- Zhen Ding Technology — World's largest PCB maker; flexible and IC substrate supplier to Apple.
- Kinsus Interconnect — Pegatron-affiliated IC substrate manufacturer.
- TTM Technologies — North America's largest PCB maker; RF and substrate components.
- LG Innotek — LG affiliate making IC substrates, camera modules, and components.
- AT&S — Austrian high-end IC substrate and PCB maker expanding advanced packaging.
- Kingboard Holdings — Major maker of copper-clad laminates and PCB materials.
- Mitsubishi Gas Chemical — Cleaning chemicals and BT substrate resin maker.
- Nippon Electric Glass — Japanese glass maker; supplies through-glass-via (TGV) glass core substrates for advanced chip packaging and image sensor cover glass.
- Simmtech — Korean maker of semiconductor substrates and memory-module PCBs.
- Samsung Electro-Mechanics — Samsung affiliate making IC substrates, MLCCs, and camera modules.
- SCHOTT AG — German specialty glass maker owned by the Carl Zeiss Foundation; supplies fused quartz for etch/epitaxy/diffusion equipment, photomask blank glass, and photostructurable FOTURAN glass wafers.
- Shinko Electric Industries — Package substrate and leadframe maker; taken private by JIC and delisted from TSE in June 2025.
- ITEQ — Copper-clad laminate and prepreg maker for high-speed PCBs.
- Daeduck Electronics — Korean PCB and IC-substrate manufacturer.
- Haesung DS — Korean leadframe and package-substrate maker.
- Absolics Inc. — SKC subsidiary building a first-of-its-kind glass core substrate mass-production fab in Covington, Georgia.
- Doosan Electro-Materials — Korean copper-clad laminate and IC-substrate materials maker.
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