Outsourced Assembly & Test companies
21 companies in the Outsourced Assembly & Test part of the semiconductor & AI value chain.
Companies
- ASE Technology — World's largest OSAT, includes SPIL; key advanced packaging partner.
- Amkor Technology — Second-largest OSAT; building advanced packaging capacity in Arizona.
- JCET Group — China's largest OSAT (includes former STATS ChipPAC).
- Tongfu Microelectronics — Chinese OSAT and AMD's main packaging partner via JV fabs.
- King Yuan Electronics (KYEC) — Largest dedicated test house; heavy AI GPU test exposure.
- Huatian Technology — Top-three Chinese OSAT provider.
- Powertech Technology (PTI) — Memory-focused OSAT leader in Taiwan.
- Chipbond Technology — Display-driver IC bumping, COG, and gold-bump packaging and test leader.
- Unisem — Malaysian OSAT providing chip assembly and test services.
- Greatek Electronics — Taiwanese OSAT specializing in memory and logic packaging.
- ChipMOS Technologies — OSAT focused on display driver and memory packaging/test.
- Orient Semiconductor (OSE) — Taiwanese outsourced assembly and test provider.
- SFA Semicon — Korean OSAT, the former STS Semiconductor.
- Nepes — Korean OSAT specializing in fan-out advanced packaging.
- LB Semicon — Korean OSAT focused on display driver packaging.
- Lingsen Precision — Taiwanese outsourced assembly and test provider.
- Hana Micron — Korean OSAT serving Samsung and SK hynix memory packaging.
- Integra Technologies — US OSAT for high-reliability and defense applications.
- Sigurd Microelectronics — Taiwanese IC final-test and assembly provider.
- UTAC Holdings — Singapore-based OSAT for analog and mixed-signal devices.
- Walton Advanced Engineering — Memory and logic packaging and test services.