Equipment (Back End) companies
24 companies in the Equipment (Back End) part of the semiconductor & AI value chain.
Subsegments
Companies
- Advantest — Test leader; its testers qualify nearly every AI accelerator and HBM stack.
- Teradyne — One half of the ATE duopoly with Advantest; strong in SoC and analog test.
- DISCO — Controls most of the market for wafer dicing and grinding equipment.
- BE Semiconductor Industries — Assembly equipment leader and front-runner in hybrid bonding.
- Technoprobe — Leading probe card maker for advanced logic and memory test.
- Hanmi Semiconductor — Korean leader in TC bonders used to stack HBM memory.
- FormFactor — World's largest probe card maker for wafer test.
- ASMPT — Largest back-end assembly and packaging equipment maker; TCB leader.
- Kulicke & Soffa — Dominant in wire bonders; expanding into advanced packaging.
- TOWA — Leader in semiconductor molding/encapsulation equipment.
- EV Group — Private Austrian leader in wafer bonding and litho for packaging.
- Keysight Technologies — Test and measurement leader; RF, photonic, and high-speed EDA tools.
- Chroma ATE — Taiwanese test and measurement instrument maker for semis and batteries.
- MPI Corporation — Probe cards and test and measurement systems maker.
- Nordson — Dispensing, bonding inspection, and test systems for electronics and semis.
- Tokyo Seimitsu (Accretech) — Wafer dicing, grinding, and metrology equipment maker.
- Leeno Industrial — Korean probe pin and test socket maker.
- Cohu — Test handlers, contactors and inspection for back-end test cells.
- ISC — Korean burn-in and test socket maker.
- SUSS MicroTec — Packaging lithography, coaters and bonders for advanced packaging.
- SEMES — Samsung's in-house equipment arm; etch, cleaning, and packaging tools.
- Hangzhou Changchuan Technology — Chinese test handler and tester maker.
- Aehr Test Systems — Wafer-level burn-in test systems, used heavily for SiC devices.
- inTEST — Thermal and test-handling solutions for semiconductor test.