Assembly & Packaging Equipment companies

7 companies in the Assembly & Packaging Equipment part of the semiconductor & AI value chain.

Companies

  • DISCO — Controls most of the market for wafer dicing and grinding equipment. leader · TSE:6146 · Japan
  • ASMPT — Largest back-end assembly and packaging equipment maker; TCB leader. leader · HKEX:0522 · Singapore
  • TOWA — Leader in semiconductor molding/encapsulation equipment. leader · TSE:6315 · Japan
  • Nordson — Dispensing, bonding inspection, and test systems for electronics and semis. major · NASDAQ:NDSN · $2.8B · USA
  • Tokyo Seimitsu (Accretech) — Wafer dicing, grinding, and metrology equipment maker. major · TSE:7729 · Japan
  • SUSS MicroTec — Packaging lithography, coaters and bonders for advanced packaging. major · FWB:SMHN · Germany
  • SEMES — Samsung's in-house equipment arm; etch, cleaning, and packaging tools. major · South Korea

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