Amkor Technology supply chain risk
As of 2026-09-05, Amkor Technology depends on 16 tracked suppliers headquartered in 7 countries (6 of them in Japan). 7 of those suppliers hold a monopoly or leader position in their own segment, led by Teradyne, DISCO and BE Semiconductor Industries. Amkor Technology itself carries a supply-chain criticality score of 68/100, with 235 tracked companies downstream of it.
Data as of 2026-09-05 · suppliers are the curated key_supplier edges in the wafergraph dataset (researched or segment-inferred — see /methodology) · criticality is the graph-derived chokepoint score, 0–100
Dominant and single-source suppliers
- Teradyne — leader in Test Equipment, United States
- DISCO — leader in Assembly & Packaging Equipment, Japan
- BE Semiconductor Industries — leader in Bonders, Netherlands
- ASMPT — leader in Assembly & Packaging Equipment, Singapore
- Kulicke & Soffa — leader in Bonders, Singapore
- Mitsui High-tec — leader in Packaging Materials (Leadframes, Bonding Wire), Japan
- TOWA — leader in Assembly & Packaging Equipment, Japan
A monopoly or leader supplier is the hardest to replace. These are the edges to watch first.
Suppliers by country
- Japan — 6 suppliers (38%)
- United States — 3 suppliers (19%)
- Singapore — 2 suppliers (13%)
- Taiwan — 2 suppliers (13%)
- Netherlands — 1 supplier (6%)
- Germany — 1 supplier (6%)
- Switzerland — 1 supplier (6%)
All 16 tracked suppliers
| Supplier | Segment | Position | Country | Criticality |
|---|---|---|---|---|
| Teradyne | Test Equipment | leader | United States | 81/100 |
| DISCO | Assembly & Packaging Equipment | leader | Japan | 81/100 |
| BE Semiconductor Industries | Bonders | leader | Netherlands | 81/100 |
| ASMPT | Assembly & Packaging Equipment | leader | Singapore | 82/100 |
| Kulicke & Soffa | Bonders | leader | Singapore | 82/100 |
| Mitsui High-tec | Packaging Materials (Leadframes, Bonding Wire) | leader | Japan | 82/100 |
| TOWA | Assembly & Packaging Equipment | leader | Japan | 82/100 |
| Chroma ATE | Test Equipment | major | Taiwan | 68/100 |
| Nordson | Test Equipment | major | United States | 68/100 |
| Sumitomo Metal Mining | Packaging Materials (Leadframes, Bonding Wire) | major | Japan | 68/100 |
| Tokyo Seimitsu (Accretech) | Assembly & Packaging Equipment | major | Japan | 68/100 |
| Cohu | Test Equipment | major | United States | 69/100 |
| Chang Wah Technology | Packaging Materials (Leadframes, Bonding Wire) | major | Taiwan | 69/100 |
| SUSS MicroTec | Assembly & Packaging Equipment | major | Germany | 69/100 |
| Tanaka Precious Metals | Packaging Materials (Leadframes, Bonding Wire) | major | Japan | 69/100 |
| Evatec | Deposition | niche | Switzerland | 50/100 |
Downstream exposure
- Criticality score: 68/100
- Companies downstream of Amkor Technology: 235
- Tracked market cap downstream (priced companies only): $34.67T across 149 priced companies
Cite as: wafergraph, “Amkor Technology supply chain risk — 16 suppliers, single-source exposure & criticality”, https://wafergraph.com/supply-chain-risk/amkor (data as of 2026-09-05).
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